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H

He, Siliang

guilin university of electronic technology

0H指数
3论文数
0被引数
收录论文 5
发表时间
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Unique sapphire @ layered PiGF @ sapphire color converter for high-quality laser-driven white lighting独特的蓝宝石@层状PiGF@蓝宝石色彩转换器，用于高质量激光驱动白光照明
errJournal of Alloys and Compounds
IF6.3
err2026-08-01
err0
PREAI
errLiu, Ruijie; Zhao, Jiuzhou; Ye, Meiqi; Chen, Siyu; Huang, Yiqian; Wang, Qing; He, Siliang; Mou, Yun; Peng, Yang
err分享
err收藏
Sn-Coated Cu Solder Paste for Power Devices Based on Transient Liquid Phase BondingSn涂层Cu焊膏用于基于瞬时液相键合的功率器件
errCrystals
IF2.4
err2026-05-01
err1
PREAI
errQin, Xingwen; Yin, Dongxian; Yu, Zibo; Qin, Hongbo; Yan, Haidong; Wu, Junke; Li, Jian; He, Siliang
err分享
err收藏
A comparative study of the mechanical properties of sintered submicron and micron Cu烧结亚微米和微米Cu的力学性能比较研究
errSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
err2026-04-01
err1
PREAI
errHuang, Jian; Wang, Bi; He, Siliang; Cai, Miao; Qin, Hongbo; Yan, Haidong
err分享
err收藏
Size effect on shear performance of microscale ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints under current stressing微尺度球栅阵列结构Cu/Sn-3.0Ag-0.5Cu/Cu焊点在电流应力下的尺寸效应对剪切性能的影响
errSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
err2026-01-01
err0
PREAI
errWang, Bo; Ke, Zhanglong; Chen, Zimeng; Li, Wangyun; Huang, Wei; He, Siliang; Pan, Kailin; Nishikawa, Hiroshi
err分享
err收藏
High Cu-Cu Bonding Strength Achievement Using Micron Copper Particles Under Formic Acid Atmosphere在甲酸气氛下使用微米铜颗粒实现高Cu-Cu键合强度
errPROCESSES
IF2.8
err2025-03-31
err0
errOAAI
errLi, Bofu; Luo, Yinyin; Li, Dejian; Li, Dameng; Yang, Baobin; Gong, Baoliang; Han, Shunfeng; He, Siliang; Cai, Miao
err分享
err收藏

研究方向

暂时未获取到该数据
合作学者
合作期刊
刘
刘睿杰 (Ruijie Liu)
H 指数: 43 · 论文数: 302
彭
彭洋 (Yang Peng)
H 指数: 41 · 论文数: 237
Y
Yun Mou
H 指数: 31 · 论文数: 114
王
王波 (Bo Wang)
H 指数: 16 · 论文数: 90
B
Bofu Li
H 指数: 13 · 论文数: 61
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