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D

D. Josell

national institute of standards and technology

42H指数
263论文数
6.2K被引数
收录论文 77
发表时间
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High-density void-free gold sub-micrometer gratings for X-ray grating interferometry高密度无缺陷金亚微米光栅用于X射线光栅干涉测量
errMaterials Science in Semiconductor Processing
IF4.6
err2026-05-28
err0
PREAI
errLiyang Chen; Qihui Yu; Ji Hye Kang; Alexandre Pereira; Gianluca Iori; Mattia Guscetti; Daniel Josell; Konstantins Jefimovs; Marco Stampanoni; Lucia Romano
err分享
err收藏
Improved Uniformity in Glass TSV Filling by Asymmetric Dwell Pulsed Potential Deposition通过非对称保持脉冲电位沉积改善玻璃TSV填充的均匀性
errJournal of the Electrochemical Society
IF3.3
err2026-04-01
err0
errOAAI
errYoujung Kim; Eunsoo Shim; Ji Young Park; Matthew S. Weimer; Sara Harris; David Raciti; Bongyoung Yoo; Jae-Hong Lim; Yong-Ho Choa; Thomas P. Moffat; Daniel Josell
err分享
err收藏
Deep-reactive-ion-etching in X-ray grating fabrication: a review深反应离子刻蚀在X射线光栅制备中的应用：综述
errMaterials Science in Semiconductor Processing
IF4.6
err2025-09-15
err0
errOAAI
errZhitian Shi; Konstantins Jefimovs; Joan Vila-Comamala; Alexandre Pereira; Daniel Josell; Marco Stampanoni; Lucia Romano
err分享
err收藏
Quantifying grating defects in X-ray Talbot-Lau interferometry through a comparative study of two fabrication techniques通过比较两种制造技术的对比研究，对X射线Talbot-Lau干涉测量法中的光栅缺陷进行量化
errSCIENTIFIC REPORTS
IF3.9
err2025-04-24
err0
errOAAI
errPereira, Alexandre; Spindler, Simon; Shi, Zhitian; Romano, Lucia; Rawlik, Michal; Marone, Federica; Josell, Daniel; Stauber, Martin; Stampanoni, Marco
err分享
err收藏
Bottom-up Gold Filling of Sub-Micrometer Trenches
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2025-04-01
err0
errOAAI
errJosell, D.; Jefimovs, K.; Romano, L.
err分享
err收藏
Fabrication of Ultra-Thick Masks for X-Ray Phase Contrast Imaging at Higher Energy
errADVANCED MATERIALS INTERFACES
IF4.4
err2025-02-16
err0
errOAAI
errRossi, Alessandro; Buchanan, Ian; Astolfo, Alberto; Michalska, Martyna; Briglin, Daniel; Charman, Anton; Josell, Daniel; Olivo, Alessandro; Papakonstantinou, Ioannis
err分享
err收藏
A four-grating interferometer for x-ray multi-contrast imaging用于x射线多对比成像的四光栅干涉仪
errMEDICAL PHYSICS
IF3.2
err2024-04-01
err2
errOAAI
errMiao, Houxun; Williams, James C.; Josell, Daniel
err分享
err收藏
Bottom-up Gold Filling of Trenches in Curved Wafers
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2024-03-04
err2
PREAI
errJosell, D.; Raciti, D.; Gnaupel-Herold, T.; Pereira, A.; Tsai, V.; Yu, Q.; Chen, L.; Stauber, M.; Rawlik, M.; Stampanoni, M.; Moffat, T. P.; Romano, L.
err分享
err收藏
Implementation of a dual-phase grating interferometer for multi-scale characterization of building materials by tunable dark-field imaging
errSCIENTIFIC REPORTS
IF3.9
err2024-01-03
err5
errOAAI
errOrganista, Caori; Tang, Ruizhi; Shi, Zhitian; Jefimovs, Konstantins; Josell, Daniel; Romano, Lucia; Spindler, Simon; Kibleur, Pierre; Blykers, Benjamin; Stampanoni, Marco; Boone, Matthieu N.
err分享
err收藏
Superconformal Film Growth: From Smoothing Surfaces to Interconnect Technology
errACCOUNTS OF CHEMICAL RESEARCH
IF17.7
err2023-04-20
err18
PREAI
errMoffat, Thomas P.; Braun, Trevor M.; Raciti, David; Josell, Daniel
err分享
err收藏
Extreme Bottom-up Gold Filling of High Aspect Ratio Features
errACCOUNTS OF CHEMICAL RESEARCH
IF17.7
err2023-02-27
err2
PREAI
errJosell, Daniel; Moffat, Thomas P.
err分享
err收藏
Mechanism of Bismuth Stimulated Bottom-up Gold Feature Filling
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2022-12-30
err6
errOAAI
errJosell, D.; Braun, T. M.; Moffat, T. P.
err分享
err收藏
Survey of P-Block Metal Additives for Superconformal Cu Deposition in an Alkaline Electrolyte
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2022-09-07
err0
errOAAI
errJosell, D.; Moffat, T. P.
err分享
err收藏
Robust Bottom-Up Gold Filling of Deep Trenches and Gratings
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2022-03-25
err9
errOAAI
errJosell, D.; Osborn, W. A.; Williams, M. E.; Miao, H.
err分享
err收藏
Microstructure and Texture in Copper Filled Millimeter Scale Through Silicon Vias
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2022-03-17
err4
errOAAI
errKim, S-H; Braun, T. M.; Lee, H-J; Moffat, T. P.; Josell, D.
err分享
err收藏
Simulating the Influence of Supporting Electrolyte Concentration on Copper Electrodeposition in Microvias
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2022-01-18
err14
errOAAI
errBraun, T. M.; John, J.; Jayaraju, N.; Josell, D.; Moffat, T. P.
err分享
err收藏
Effect of Chloride on Microstructure in Cu Filled Microscale Through Silicon Vias
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2021-11-02
err8
errOAAI
errKim, S-H; Lee, H-J; Braun, T. M.; Moffat, T. P.; Josell, D.
err分享
err收藏
Bottom-Up Gold Filling in New Geometries and Yet Higher Aspect Ratio Gratings for Hard X-ray Interferometry
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2021-08-24
err11
errOAAI
errJosell, D.; Shi, Z.; Jefimovs, K.; Guzenko, V. A.; Beauchamp, C.; Peer, L.; Polikarpov, M.; Moffat, T. P.
err分享
err收藏
Simulating Cu electrodeposition in high aspect ratio features: Effect of control mode and uncompensated resistance in S-NDR systems
errELECTROCHIMICA ACTA
IF5.6
err2021-04-01
err13
errOAAI
errBraun, T. M.; Josell, D.; Moffat, T. P.
err分享
err收藏
Simulation of Copper Electrodeposition in Millimeter Size Through-Silicon Vias在毫米尺寸的硅通孔中电沉积铜的模拟
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2020-12-16
err13
errOAAI
errBraun, T. M.; Josell, D.; Deshpande, S.; John, J.; Moffat, T. P.
err分享
err收藏

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