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Vijay D. Chavan

Sejong University
H指数:17
被引数:927

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Exploring ultrathin tungsten disulfide as a diffusion barrier for copper interconnects: advanced packaging reliability and a first-principles study

探索超薄二硫化钨作为铜互连扩散阻挡层:先进封装可靠性及第一性原理研究

2025-06-010
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Property-Performance Relationship of Waste Floral Foam-Derived Nanoporous Carbon as Metal-Free Oxygen Evolution Reaction and Hydrogen Evolution Reaction Electrocatalyst: Implications of N and S Doping

废花卉泡沫衍生的纳米多孔碳作为无金属析氧反应和析氢反应电催化剂的性能-性能关系: N和S掺杂的含义

2025-02-091
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Advanced functional materials and their coordinated composites for next-generation Li-S batteries: A brief review

下一代li-s电池的先进功能材料及其协同复合材料: 简要综述

2024-05-016
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