Daeyoung Kong

kyung hee university

H指数:14

被引数:635

个人简介

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教育背景

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工作经历

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Capillary-driven two-phase cooler for high-heat-flux electronics using copper wire mesh manifold and enhanced copper inverse opal wick heat sink

基于铜丝网配管和增强型铜反向opal多孔结构散热器的毛细驱动两相冷却器，用于高热流密度电子设备

Applied Thermal Engineering

IF6.9

2026-07-010

PRE

Computational Fluid Dynamics Modeling and Optimization of Large-Scale (3 CM x 3 CM) Silicon-Based Embedded Microchannels With Three-Dimensional Manifold Microcoolers

JOURNAL OF ELECTRONIC PACKAGING

IF2.3

2025-12-011

PRE

Mitigation of Boiling-Induced Thermal Degradation Using Microporous Nickel Inverse Opals Structures

利用微孔镍反蛋白石结构缓解沸腾诱导的热降解

JOURNAL OF ELECTRONIC PACKAGING

IF2.3

2025-12-010

PRE

Development of a Capillary-driven Two-Phase Microcooler using Copper Wiremesh 3D Manifold and Silicon Micropin Fin Wicks

基于铜丝网3D manifolds和硅微针肋wicks的毛细驱动两相微冷器开发

International Journal of Mechanical Sciences

IF9.4

2025-09-010

PRE

Thermal-Hydraulic characterization in Manifold-microchannel heat sinks for Energy-efficient cooling of HEV/EV power modules

APPLIED THERMAL ENGINEERING

IF6.9

2025-04-010

PRE

Micro-/Nanohierarchical Surfaces for Enhanced Pool Boiling in Large-Area Silicon Multichips

大尺寸硅多芯片微-/纳米级分级表面强化池沸腾

SMALL STRUCTURES

IF11.3

2025-01-280

OAAI

Extreme heat flux cooling from functional copper inverse opal-coated manifold microchannels

ENERGY CONVERSION AND MANAGEMENT

IF10.9

2024-09-011

PRE

Capillary-enhanced two-phase micro-cooler using copper-inverse-opal wick with silicon microchannel manifold for high-heat-flux cooling application

INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER

IF6.4

2024-08-015

PRE

Enhanced immersion cooling using laser-induced graphene for Li-ion battery thermal management

用于锂离子电池热管理的激光诱导石墨烯增强浸没冷却

INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER

IF6.4

2024-06-010

PRE

Multimodal machine learning for predicting heat transfer characteristics in micro-pin fin heat sinks

多模态机器学习用于预测微针翅片散热器中的传热特性

CASE STUDIES IN THERMAL ENGINEERING

IF6.4

2024-05-016

OAAI

Enhanced boiling heat transfer via microporous copper surface integration in a manifold microgap

APPLIED THERMAL ENGINEERING

IF6.9

2024-03-017

PRE

Boiling-induced thermal degradation of copper inverse opals and its mitigation

INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER

IF6.4

2024-02-016

PRE

Thermal performance analysis of heat pipe heat exchanger for effective waste heat recovery

有效余热回收的热管换热器热性能分析

INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER

IF6.4

2024-02-019

PRE

Experimental and computational investigation of thermal performance and fluid flow in two-phase closed thermosyphon

APPLIED THERMAL ENGINEERING

IF6.9

2023-11-016

PRE

Enhanced heat transfer in a microchannel with pseudo-roughness induced by Onsager-Wien effect

APPLIED THERMAL ENGINEERING

IF6.9

2023-10-014

PRE

An additively manufactured manifold-microchannel heat sink for high-heat flux cooling

INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES

IF9.4

2023-06-0130

PRE

A holistic approach to thermal-hydraulic design of 3D manifold microchannel heat sinks for energy-efficient cooling

CASE STUDIES IN THERMAL ENGINEERING

IF6.4

2021-12-0138

OAAI

Hierarchically Structured Laser-Induced Graphene for Enhanced Boiling on Flexible Substrates

ACS APPLIED MATERIALS & INTERFACES

IF8.2

2020-07-2439

PREAI

Analysis of the enhancing mechanism in pool boiling heat transfer through wetting speed for rough aluminum surfaces with FC-72

INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

IF5.8

2020-04-0115

PREAI

Single-phase thermal and hydraulic performance of embedded silicon micro-pin fin heat sinks using R245fa

采用R245fa的嵌入式硅微针翅片散热器的单相热性能和水力性能

INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER

IF5.8

2019-10-0140

PREAI

Daeyoung Kong

个人简介

教育背景

工作经历

荣誉奖项

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