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J

Junghwan Bang

sungkyunkwan university(skku)

H指数:14

被引数:605

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Transient Liquid Phase Bonding Using Sputtered Cu/Sn Multilayers

利用溅射Cu/Sn多层膜的瞬时液相钎焊

IF3.2

2026-10-230

OA

Controlling the solidification speed toward enhanced failure energy of Sn-0.7Cu system solder ball-attaches with alloy design using instantaneous large-area laser soldering

通过合金设计，利用瞬时大面积激光焊控制凝固速度，以提升Sn-0.7Cu体系焊球接头的失效能。

MATERIALS CHARACTERIZATION

IF5.5

2025-01-010

PRE

Improving mechanical stability of Al/Cu ultrasonic bonded joint for battery tab by adopting electroplated Ni interlayer

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

IF2.8

2024-02-071

PRE

Fast, facile and thermal damage free nanowelding of Ag nanowire for flexible transparent conductive film by pressure-assisted microwave irradiation

SCIENTIFIC REPORTS

IF3.9

2023-09-014

OAAI

Amorphous-Crystalline Interfaces on Hollow Nanocubes Derived from Ir-Doped Ni-Fe-Zn Prussian Blue Analog Enables High Capability of Alkaline/Acidic/Saline Water Oxidations

由Ir掺杂的ni-fe-zn普鲁士蓝类似物衍生的空心纳米立方体上的非晶-结晶界面可实现高碱性/酸性/盐水氧化能力

IF12.1

2023-08-231

PRE

Mechanical properties of TiC reinforced MgO-ZrO2 composites via spark plasma sintering

CERAMICS INTERNATIONAL

IF5.6

2023-06-0110

PRE

Highly increased hydrovoltaic power generation via surfactant optimization of carbon black solution for cellulose microfiber cylindrical generator

通过表面活性剂优化纤维素超细纤维圆柱形发电机的炭黑溶液的高度增加的光伏发电

SURFACES AND INTERFACES

IF6.3

2023-06-0111

OAAI

Low-iridium doped single-crystalline hydrogenated titanates (H2Ti3O7) with large exposed {100} facets for enhanced oxygen evolution reaction under acidic conditions (vol 946, 169466, 2023)

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2023-06-010

OAAI

Thermo-Compression Bonding of Cu/SnAg Pillar Bumps with Electroless Palladium Immersion Gold (EPIG) Surface Finish

IF3.2

2023-02-202

OAAI

Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate

IF3.2

2021-05-022

OAAI

Enhanced Thermo-Mechanical Reliability of Ultralow-K Dielectrics with Self-Organized Molecular Pores

IF3.2

2021-04-288

OAAI

Effect of Cu/Fe addition on the microstructures and electrical performances of Ni-Co-Mn oxides

Cu/Fe对ni-co-mn氧化物微观结构及电性能的影响

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2021-04-0119

PREAI

Interfacial Reactions and Mechanical Properties of Sn-58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding

IF3.2

2021-01-1110

OAAI

Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint

Sn-cu-xcr/Cu无铅焊点金属间化合物的形成及力学性能

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2017-12-0125

PREAI

Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2017-04-0133

PREAI

Effects of Ag addition on solid-state interfacial reactions between Sn-Ag-Cu solder and Cu substrate

MATERIALS CHARACTERIZATION

IF5.5

2017-02-0144

PREAI

Interfacial reaction and intermetallic compound formation of Sn-1Ag/ENIG and Sn-1Ag/ENEPIG solder joints

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2015-04-0146

PREAI

Interfacial reactions of fine-pitch Cu/Sn-3.5Ag pillar joints on Cu/Zn and Cu/Ni under bump metallurgies

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2014-12-0112

PREAI