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M

Mesfin Seid Ibrahim

guilin university of electronic technology

H指数:12

被引数:387

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Impacts and mitigation strategies of process-induced packaging defects for enhancing reliability of power devices

工艺诱导封装缺陷对功率器件可靠性的影响及缓解策略

Microelectronics Reliability

IF1.9

2026-02-010

PRE

In-Situ early anomaly detection and remaining useful lifetime prediction for high-power white LEDs with distance and entropy-based long short-term memory recurrent neural networks

EXPERT SYSTEMS WITH APPLICATIONS

IF7.5

2024-03-015

OAAI

Defect and texture engineering of relaxor thin films for High-Power energy storage applications

CHEMICAL ENGINEERING JOURNAL

IF13.2

2024-02-017

PRE

Junction temperature and luminous flux prediction for white LED array based on electrical-photo-thermal modeling

CASE STUDIES IN THERMAL ENGINEERING

IF6.4

2024-02-012

OAAI

The effect of pre-existing voids on solder reliability at different thermomechanical stress Levels: Experimental assessment

不同热机械应力水平下预先存在的空隙对焊料可靠性的影响: 实验评估

MATERIALS & DESIGN

IF7.9

2023-09-016

OAAI

Bayesian based lifetime prediction for high-power white LEDs

EXPERT SYSTEMS WITH APPLICATIONS

IF7.5

2021-12-0116

OAAI

Prognostics of radiation power degradation lifetime for ultraviolet light-emitting diodes using stochastic data-driven models

IF9.6

2021-06-015

OAAI

System level reliability assessment for high power light-emitting diode lamp based on a Bayesian network method

IF5.6

2021-05-0119

OAAI

A Gamma process-based degradation testing of silicone encapsulant used in LED packaging

POLYMER TESTING

IF6

2021-04-019

OAAI

Machine Learning and Digital Twin Driven Diagnostics and Prognostics of Light-Emitting Diodes

LASER & PHOTONICS REVIEWS

IF10

2020-10-2143

OAAI

Random Voids Generation and Effect of Thermal Shock Load on Mechanical Reliability of Light-Emitting Diode Flip Chip Solder Joints

IF3.2

2019-12-2311

OAAI