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H

Hideyuki Yasuda

Kyoto University

43H指数
359论文数
6.2K被引数
收录论文 62
发表时间
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Efficient parameter estimation from a planar interface in directional solidification via AMR-accelerated phase-field data assimilation通过AMR加速的相场数据同化从定向凝固平面界面进行高效参数估计
errJournal of Materials Research and Technology
IF6.6
err2025-10-13
err0
errOAAI
errAyano Yamamura; Shinji Sakane; Hideyuki Yasuda; Tomohiro Takaki
err分享
err收藏
Growth crystallography and in-situ imaging of nucleation and growth dynamics of Al8Mn5 solidifying in AZ magnesium alloys生长晶体学和原位成像技术对AZ镁合金中Al8Mn5固溶体形核与生长动力学的研究
errActa Materialia
IF9.3
err2025-05-23
err0
PREAI
errD. Wang; G. Zeng; J.W. Xian; K. Nogita; H. Yasuda; C.M. Gourlay
err分享
err收藏
Twin experiments and detailed investigation of data assimilation system for columnar dendrite growth in thin film
errACTA MATERIALIA
IF9.3
err2024-12-01
err0
errOAAI
errYamamura, Ayano; Sakane, Shinji; Ohno, Munekazu; Yasuda, Hideyuki; Takaki, Tomohiro
err分享
err收藏
Solidification microstructures of V-Nb-Mo-Ta-W alloys: Insights from non-equiatomic alloys
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2024-04-01
err3
PREAI
errKatsube, Ryoji; Tokuri, Shigehiro; Nakano, Keita; Narumi, Taka; Yasuda, Hideyuki
err分享
err收藏
In Situ Observation of the Ga- and Cu-Based Substrate Reaction by Synchrotron Microradiography
errACS APPLIED ELECTRONIC MATERIALS
IF4.7
err2023-12-11
err1
PREAI
errHao, Qichao; Tan, Xin Fu; Liu, Shiqian; McDonald, Stuart D.; Yasuda, Hideyuki; Nogita, Kazuhiro
err分享
err收藏
Contribution of Ni microalloying to Cu dissolution in In-35Sn/Cu solder joints after multiple reflows多次回流后Ni微合金化对In-35Sn/Cu焊点中Cu溶解的贡献
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2023-09-01
err5
errOAAI
errChang, M. S.; Salleh, M. A. A. Mohd; Halin, D. S. C.; Somidin, F.; Yasuda, H.; Nogita, K.
err分享
err收藏
The effectiveness of Ni microalloying on the microstructure and mechanical properties of low temperature In-35 wt%Sn/Cu solder joint
errMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
IF7
err2023-08-01
err7
PREAI
errChang, M. S.; Salleh, M. A. A. Mohd; Somidin, F.; Halin, D. S. C.; Yasuda, H.; Nogita, K.
err分享
err收藏
Solidification sequence of CrMnFeCoCu dual-FCC multicomponent alloy
errSCRIPTA MATERIALIA
IF5.6
err2023-07-01
err2
PREAI
errKatsube, Ryoji; Luo, Litian; Nakano, Keita; Narumi, Taka; Yasuda, Hideyuki
err分享
err收藏
Effects of Multiple Reflow on the Formation of Primary Crystals in Sn-3.5Ag and Solder Joint Strength: Experimental and Finite Element Analysis
errMATERIALS
IF3.2
err2023-06-13
err3
errOAAI
errAmli, Siti Farahnabilah Muhd; Salleh, Mohd Arif Anuar Mohd; Aziz, Mohd Sharizal Abdul; Yasuda, Hideyuki; Nogita, Kazuhiro; Abdullah, Mohd Mustafa Al Bakri; Nemes, Ovidiu; Sandu, Andrei Victor; Vizureanu, Petrica
err分享
err收藏
Nucleation and growth of Ag3Sn in Sn-Ag and Sn-Ag-Cu solder alloysSn-ag和sn-ag-cu焊料合金中Ag3Sn的成核和生长
errACTA MATERIALIA
IF9.3
err2023-05-01
err37
errOAAI
errCui, Y.; Xian, J. W.; Zois, A.; Marquardt, K.; Yasuda, H.; Gourlay, C. M.
err分享
err收藏
Data assimilation with phase-field lattice Boltzmann method for dendrite growth with liquid flow and solid motion
errCOMPUTATIONAL MATERIALS SCIENCE
IF3.3
err2022-12-01
err11
errOAAI
errYamamura, Ayano; Sakane, Shinji; Ohno, Munekazu; Yasuda, Hideyuki; Takaki, Tomohiro
err分享
err收藏
Properties of Sn-3 wt%Ag-5 wt%Cu alloys with Cu6Sn5 intermetallics grain refined by Mg
errMATERIALS TODAY COMMUNICATIONS
IF4.5
err2022-06-01
err10
PREAI
errTan, C. Y.; Salleh, M. A. A. Mohd; Tan, X. F.; Yasuda, H.; Saud, N.; Ramli, M. I. I.; Nogita, K.
err分享
err收藏
Controlling the distribution of porosity during transient liquid phase bonding of Sn-based solder joint控制Sn基焊点瞬态液相键合过程中孔隙率的分布
errMATERIALS TODAY COMMUNICATIONS
IF4.5
err2022-06-01
err4
PREAI
errRazak, N. R. Abdul; Tan, X. F.; Salleh, M. A. A. Mohd; McDonald, S. D.; Bermingham, M. J.; Yasuda, H.; Nogita, K.
err分享
err收藏
Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow高岭土地质聚合物陶瓷添加对多次回流过程中Sn-3.0Ag-0.5Cu焊点微观结构和剪切强度的影响
errMATERIALS
IF3.2
err2022-04-08
err3
errOAAI
errZaimi, Nur Syahirah Mohamad; Salleh, Mohd Arif Anuar Mohd; Abdullah, Mohd Mustafa Al-Bakri; Nadzri, Nur Izzati Muhammad; Sandu, Andrei Victor; Vizureanu, Petrica; Ramli, Mohd Izrul Izwan; Nogita, Kazuhiro; Yasuda, Hideyuki; Sandu, Ioan Gabriel
err分享
err收藏
The effect of Ni on the growth morphology of primary β-phase in an In-35 wt%Sn alloy
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2022-03-01
err6
PREAI
errChang, M. S.; Salleh, M. A. A. Mohd; Halin, D. S. C.; Ramli, M. I. I.; Yasuda, H.; Nogita, K.
err分享
err收藏
Peritectic phase formation kinetics of directionally solidifying Sn-Cu alloys within a broad growth rate regime
errACTA MATERIALIA
IF9.3
err2021-11-01
err18
PREAI
errMehreen, Syeda U.; Nogita, Kazuhiro; McDonald, Stuart D.; Yasuda, Hideyuki; StJohn, David H.
err分享
err收藏
Rapid fabrication of tin-copper anodes for lithium-ion battery applications
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2021-06-01
err8
PREAI
errTan, Xin Fu; Belyakov, Sergey A.; Su, Te-Cheng; Gu, Qinfen; Liu, Shiqian; McDonald, Stuart D.; Gourlay, Christopher M.; Yasuda, Hideyuki; Matsumura, Syo; Nogita, Kazuhiro
err分享
err收藏
Microstructure, thermal behavior and joint strength of Sn-0.7Cu-1.5Bi/electroless nickel immersion gold (ENIG)
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2021-05-01
err8
errOAAI
errTeoh, A. L.; Salleh, M. A. A. Mohd; Halin, D. S. C.; Foo, K. L.; Razak, N. R. Abdul; Yasuda, H.; Nogita, K.
err分享
err收藏
Two-dimensional phase-field study for spangle texture formation in hot-dip galvanizing热浸镀锌中形成花状织构的二维相场研究
errCOMPUTATIONAL MATERIALS SCIENCE
IF3.3
err2021-02-01
err5
PREAI
errTakaki, Tomohiro; Wada, Koki; Ishii, Kotaro; Yasuda, Hideyuki
err分享
err收藏
Rheological transitions in semi-solid alloys: In-situ imaging and LBM-DEM simulations
errACTA MATERIALIA
IF9.3
err2020-06-01
err16
PREAI
errSu, T. C.; O'Sullivan, C.; Yasuda, H.; Gourlay, C. M.
err分享
err收藏

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