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Shuibao Liang

Hefei University of Technology

H指数:12

被引数:407

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Physically Based Simulation of Electromigration-Induced Hillock and Void Evolution in Cu Interconnects With Grain Morphology Considerations

考虑晶粒形貌的物理基仿真：铜互连中电迁移诱导的丘疹和空洞演化

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

IF2.9

2025-12-150

PRE

Grain Morphology Effects on Void Formation and Electromigration-Induced Failure in Copper Interconnects

IEEE Transactions on Semiconductor Manufacturing

IF2.3

2025-11-010

PRE

Thermomechanical and Fatigue Analysis of SiC Power Modules with a Comparison of Sintered Silver and Copper Die Attaches

SiC功率模块的热力与疲劳分析：烧结银与铜芯片粘接工艺的比较

Journal of Electronic Materials

IF2.5

2025-11-010

PRE

A mechanical-diffusive phase field coupling model for mesoscopic simulation of chloride ions diffusion in concrete under tensile loadings

一种用于混凝土在拉伸荷载下氯离子扩散介观模拟的机械-扩散相场耦合模型

Journal of Building Engineering

IF7.4

2025-09-200

PRE

Investigation of Electro-Thermo-Mechanical Degradation and Crack Propagation of Wire Bonds in Power Modules Using Integrated Phase Field Modeling and Finite Element Analysis

IEEE TRANSACTIONS ON POWER ELECTRONICS

IF6.5

2025-02-011

PRE

Investigating the preferential growth of Bi grains in Sn-Bi based solder under thermal aging

热老化条件下sn-bi基钎料中Bi晶粒优先生长的研究

JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T

IF6.6

2024-01-013

OAAI

Heat transfer in phase change materials for integrated batteries and power electronics systems

APPLIED THERMAL ENGINEERING

IF6.9

2023-09-0130

PRE

Phase field modelling combined with data-driven approach to unravel the orientation influenced growth of interfacial Cu6Sn5 intermetallics under electric current stressing

SURFACES AND INTERFACES

IF6.3

2023-04-014

OAAI

Microstructural and mechanical characteristics of Cu-Sn intermetallic compound interconnects formed by TLPB with Cu-Sn nanocomposite

MATERIALS TODAY COMMUNICATIONS

IF4.5

2022-12-0110

OAAI

Unraveling the electric field effect on the grain-boundary migration in alumina through phase field modeling

JOURNAL OF THE AMERICAN CERAMIC SOCIETY

IF3.8

2022-11-241

PRE

Formation and evolution of hierarchical microstructures in a Ni-based superalloy investigated by in situ high-temperature synchrotron X-ray diffraction

原位高温同步辐射x射线衍射研究镍基高温合金中分级组织的形成和演化

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2022-10-017

PRE

Preferential growth of intermetallics under temperature gradient at Cu-Sn interface during transient liquid phase bonding: insights from phase field simulation

JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T

IF6.6

2022-07-013

OAAI

Fast in-situ synchrotron X-ray imaging of the interfacial reaction during self-propagating exothermic reactive bonding

IF2.9

2022-06-011

OA

Phase field study of grain boundary migration and preferential growth in non-magnetic materials under magnetic field

MATERIALS TODAY COMMUNICATIONS

IF4.5

2022-06-015

OAAI

Insight into the preferential grain growth of intermetallics under electric current stressing - A phase field modeling

SCRIPTA MATERIALIA

IF5.6

2021-10-0112

PREAI

A numerical study of heat transfer in PCM composites for the integration of batteries and power electronics

2020 IEEE 8TH ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC)

IF0

2020-09-152

PREAI

An improved phase field method by using statistical learning theory-based optimization algorithm for simulation of martensitic transformation in NiTi alloy

COMPUTATIONAL MATERIALS SCIENCE

IF3.3

2020-02-014

PREAI