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Saranarayanan Ramachandran

University of Strathclyde

H指数:8

被引数:572

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Physically Based Simulation of Electromigration-Induced Hillock and Void Evolution in Cu Interconnects With Grain Morphology Considerations

考虑晶粒形貌的物理基仿真：铜互连中电迁移诱导的丘疹和空洞演化

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

IF2.9

2025-12-150

PRE

Grain Morphology Effects on Void Formation and Electromigration-Induced Failure in Copper Interconnects

IEEE Transactions on Semiconductor Manufacturing

IF2.3

2025-11-010

PRE

Thermomechanical and Fatigue Analysis of SiC Power Modules with a Comparison of Sintered Silver and Copper Die Attaches

SiC功率模块的热力与疲劳分析：烧结银与铜芯片粘接工艺的比较

Journal of Electronic Materials

IF2.5

2025-11-010

PRE

Probing dendrite growth under microgravity via machine learning-aided multi-scale characterisation

通过机器学习辅助的多尺度表征探测微重力下的枝晶生长

Acta Materialia

IF9.3

2025-10-210

OAAI

Investigation of Electro-Thermo-Mechanical Degradation and Crack Propagation of Wire Bonds in Power Modules Using Integrated Phase Field Modeling and Finite Element Analysis

IEEE TRANSACTIONS ON POWER ELECTRONICS

IF6.5

2025-02-011

PRE

Fatigue prediction through quantification of critical defects and crack growth behaviour in additively manufactured Ti-6Al-4V alloy

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

IF7

2024-06-012

OAAI

Solidification microstructure variations in additively manufactured Ti-6Al-4V using laser powder bed fusion

SCRIPTA MATERIALIA

IF5.6

2023-07-0110

OAAI

Fast in-situ synchrotron X-ray imaging of the interfacial reaction during self-propagating exothermic reactive bonding

IF2.9

2022-06-011

OA

Decisive influence of critical process parameters on the microstructure and tensile properties of friction stir back extruded magnesium alloy tubes

JOURNAL OF MANUFACTURING PROCESSES

IF6.8

2022-01-014

PRE