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K

Kuo‐Ning Chiang

national tsing hua university

31H指数
347论文数
3.4K被引数
收录论文 19
发表时间
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Role of annealed copper plasticity in process-induced warpage of SiC power modules退火铜塑性在SiC功率模块加工诱导翘曲中的作用
errMaterials Science in Semiconductor Processing
IF4.6
err2026-09-19
err0
PREAI
errHsien-Chie Cheng; Yi-Hsin Liao; Wen-You Jhu; Kuo-Ning Chiang; Yan-Cheng Liu; Kuo-Shu Kao; Tao-Chih Chang
err分享
err收藏
Multi-Algorithm Ensemble Learning Framework for Predicting the Solder Joint Reliability of Wafer-Level Packaging多算法集成学习框架用于预测晶圆级封装的焊点可靠性
errMaterials
IF3.2
err2026-03-03
err0
errOAAI
errQinghua Su; Kuo-Ning Chiang
err分享
err收藏
A Small Database with an Adaptive Data Selection Method for Solder Joint Fatigue Life Prediction in Advanced Packaging
errMATERIALS
IF3.2
err2024-08-17
err1
errOAAI
errSu, Qinghua; Yuan, Cadmus; Chiang, Kuo-Ning
err分享
err收藏
Coefficient Extraction of SAC305 Solder Constitutive Equations Using Equation-Informed Neural Networks
errMATERIALS
IF3.2
err2023-07-10
err6
errOAAI
errYuan, Cadmus; Su, Qinghua; Chiang, Kuo-Ning
err分享
err收藏
Predicting Wafer-Level Package Reliability Life Using Mixed Supervised and Unsupervised Machine Learning Algorithms
errMATERIALS
IF3.2
err2022-05-30
err12
errOAAI
errSu, Qing-Hua; Chiang, Kuo-Ning
err分享
err收藏
An Overview of AI-Assisted Design-on-Simulation Technology for Reliability Life Prediction of Advanced Packaging
errMATERIALS
IF3.2
err2021-09-16
err18
errOAAI
errPanigrahy, Sunil Kumar; Tseng, Yi-Chieh; Lai, Bo-Ruei; Chiang, Kuo-Ning
err分享
err收藏
Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging
errMICROMACHINES
IF3
err2021-03-10
err10
errOAAI
errWang, Pao-Hsiung; Huang, Yu-Wei; Chiang, Kuo-Ning
err分享
err收藏
Three-dimensional semi-elliptical modeling of melt pool geometry considering hatch spacing and time spacing in metal additive manufacturing
errJOURNAL OF MANUFACTURING PROCESSES
IF6.8
err2019-09-01
err38
PREAI
errMirkoohi, Elham; Sievers, Daniel E.; Garmestani, Hamid; Chiang, Kuoning; Liang, Steven Y.
err分享
err收藏
First-principles density functional calculations of physical properties of orthorhombic Au2Al crystal正交Au2Al晶体物理性质的第一性原理密度泛函计算
errINTERMETALLICS
IF4.8
err2015-07-01
err26
PREAI
errChen, Wen-Hwa; Yu, Ching-Feng; Chiang, Kuo-Ning; Cheng, Hsien-Chie
err分享
err收藏
A robust nano-mechanics approach for tensile and modal analysis using atomistic-continuum mechanics method
errCOMPUTATIONAL MATERIALS SCIENCE
IF3.3
err2011-05-01
err1
PREAI
errHuang, Chao-Jen; Wu, Chung-Jung; Teng, Hung-An; Chiang, Kuo-Ning
err分享
err收藏
Sensitivity analysis of packaging effect of silicon-based piezoresistive pressure sensor硅基压阻式压力传感器封装效应灵敏度分析
errSENSORS AND ACTUATORS A-PHYSICAL
IF4.9
err2009-05-01
err69
PREAI
errChou, Tsung-Lin; Chu, Chen-Hung; Lin, Chun-Te; Chiang, Kuo-Ning
err分享
err收藏
Prediction of the bulk elastic constant of metals using atomic-level single-lattice analytical method
errAPPLIED PHYSICS LETTERS
IF3.6
err2006-04-25
err10
PREAI
errChiang, KN; Chou, CY; Wu, CJ; Yuan, CA
err分享
err收藏
Current crowding-induced electromigration in SnAg3.0Cu0.5 microbumps - art. no. 072102
errAPPLIED PHYSICS LETTERS
IF3.6
err2006-02-13
err53
PREAI
errChiang, KN; Lee, CC; Lee, CC; Chen, KM
err分享
err收藏
Mechanical characteristic of ssDNA/dsDNA molecule under external loading
errAPPLIED PHYSICS LETTERS
IF3.6
err2006-01-12
err7
PREAI
errChiang, KN; Yuan, CA; Han, CN; Chou, CY; Cui, YJ
err分享
err收藏
Packaging effect investigation of CMOS compatible pressure sensor using flip chip and flex circuit board technologies使用倒装芯片和柔性电路板技术的CMOS兼容压力传感器的封装效果研究
errSENSORS AND ACTUATORS A-PHYSICAL
IF4.9
err2006-01-01
err21
PREAI
errLee, CC; Peng, CT; Chiang, KN
err分享
err收藏
Local-strain effects in Si/SiGe/Si islands on oxide
errAPPLIED PHYSICS LETTERS
IF3.6
err2005-10-31
err16
PREAI
errChiang, KN; Chang, CH; Peng, CT
err分享
err收藏
Design and analysis of gasket sealing of cylinder head under engine operation conditions
errFINITE ELEMENTS IN ANALYSIS AND DESIGN
IF3.5
err2005-06-01
err26
PREAI
errLee, CC; Chiang, KN; Chen, WK; Chen, RS
err分享
err收藏
Performance and package effect of a novel piezoresistive pressure sensor fabricated by front-side etching technology新型正面刻蚀压阻式压力传感器的性能及封装效应
errSENSORS AND ACTUATORS A-PHYSICAL
IF4.9
err2005-03-01
err53
PREAI
errPeng, CT; Lin, JC; Lin, CT; Chiang, KN
err分享
err收藏
Coplanarity analysis and validation of PBGA and T2 -BGA packages
errFINITE ELEMENTS IN ANALYSIS AND DESIGN
IF3.5
err2002-10-01
err9
PREAI
errChen, KM; Horng, KH; Chiang, KN
err分享
err收藏

研究方向

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合作学者
合作期刊
S
Steven Y. Liang
H 指数: 63 · 论文数: 714
H
Hamid Garmestani
H 指数: 53 · 论文数: 352
C
Chang‐Chun Lee
H 指数: 27 · 论文数: 278
H
Hsien‐Chie Cheng
H 指数: 27 · 论文数: 158
W
Wen‐Hwa Chen
H 指数: 26 · 论文数: 179
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