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H

Hsien‐Chie Cheng

Feng Chia University

27H指数
156论文数
2.1K被引数
收录论文 31
发表时间
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A hierarchical sub-modeling approach for the thermo-mechanical analysis of a TFT-FOPLP一种用于TFT-FOPLP热-力分析的分层子模型方法
errScience Progress
IF2.9
err2025-12-01
err0
errOAAI
errHsien-Chie Cheng; Ching-Feng Yu
err分享
err收藏
First-principles analysis of structural stability; mechanical anisotropy; and thermophysical and electronic properties of Cu–Pd intermetallic compounds: a comparative study of CuPd; CuPd3; Cu3Pd; and Cu4Pd基于第一性原理的结构稳定性分析；力学各向异性；以及Cu–Pd金属间化合物的热物理和电子性质：CuPd、CuPd3、Cu3Pd和Cu4Pd的对比研究
errNew J. Chem.
IF2.5
err2025-08-17
err0
PREAI
errHsien-Chie Cheng; Ching-Feng Yu
err分享
err收藏
In-Depth DFT-Based Analysis of the Structural, Mechanical, Thermodynamic, and Electronic Characteristics of CuP2 and Cu3P: Insights into Material Stability and Performance基于DFT的CuP2和Cu3P的结构、力学、热力学和电子特性的深度分析：关于材料稳定性和性能的见解
errMETALS
IF2.5
err2025-03-27
err0
errOAAI
errYu, CF; Cheng, HC
err分享
err收藏
Dynamic Performance Evaluation of Bidirectional Bridgeless Interleaved Totem-Pole Power Factor Correction Boost Converter
errMICROMACHINES
IF3
err2025-02-16
err0
errOAAI
errCheng, Hsien-Chie; Jhu, Wen-You; Liu, Yu-Cheng; Zheng, Da-Wei; Liu, Yan-Cheng; Chang, Tao-Chih
err分享
err收藏
Effective Macroscopic Thermomechanical Characterization of Multilayer Circuit Laminates for Advanced Electronic Packaging
errMATERIALS
IF3.2
err2023-12-03
err0
errOAAI
errCheng, Hsien-Chie; Jhu, Wen-You
err分享
err收藏
Development and Performance Evaluation of Integrated Hybrid Power Module for Three-Phase Servo Motor Applications
errMICROMACHINES
IF3
err2023-06-30
err4
errOAAI
errCheng, Hsien-Chie; Liu, Yan-Cheng; Lin, Hsin-Han; Chiou, Shian-Chiau; Tzeng, Chih-Ming; Chang, Tao-Chih
err分享
err收藏
Development of ANN-Based Warpage Prediction Model for FCCSP via Subdomain Sampling and Taguchi Hyperparameter Optimization
errMICROMACHINES
IF3
err2023-06-28
err7
errOAAI
errCheng, Hsien-Chie; Ma, Chia-Lin; Liu, Yang-Lun
err分享
err收藏
Transient Electro-Thermal Coupled Modeling of Three-Phase Power MOSFET Inverter during Load Cycles
errMATERIALS
IF3.2
err2021-09-19
err7
errOAAI
errCheng, Hsien-Chie; Lin, Siang-Yu; Liu, Yan-Cheng
err分享
err收藏
Theoretical and Experimental Investigation of Warpage Evolution of Flip Chip Package on Packaging during Fabrication倒装芯片封装在封装过程中翘曲演变的理论和实验研究
errMATERIALS
IF3.2
err2021-08-25
err22
errOAAI
errCheng, Hsien-Chie; Tai, Ling-Ching; Liu, Yan-Cheng
err分享
err收藏
Mechanical property assessment of black phosphorene nanotube using molecular dynamics simulation黑色磷烯纳米管力学性能的分子动力学模拟评价
errCOMPUTATIONAL MATERIALS SCIENCE
IF3.3
err2017-06-01
err11
PREAI
errChen, Wen-Hwa; Yu, Ching-Feng; Chen, I-Chu; Cheng, Hsien-Chie
err分享
err收藏
Theoretical assessment of structural, mechanical, and thermodynamic properties of Pd2AlPd2Al的结构，机械和热力学性质的理论评估
errSOLID STATE SCIENCES
IF3.3
err2017-06-01
err1
PREAI
errChen, Wen-Hwa; Yu, Ching-Feng; Cheng, Hsien-Chie
err分享
err收藏
The mechanical, thermodynamic, and electronic properties of cubic Au4Al crystal via first-principles calculations
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2016-12-01
err19
PREAI
errChen, Wen-Hwa; Cheng, Hsien-Chie; Yu, Ching-Feng
err分享
err收藏
Influence of structural defect on thermal-mechanical properties of phosphorene sheets结构缺陷对磷烯片材热机械性能的影响
errJOURNAL OF MATERIALS SCIENCE
IF3.9
err2016-11-22
err21
PREAI
errChen, Wen-Hwa; Chen, I-Chu; Cheng, Hsien-Chie; Yu, Ching-Feng
err分享
err收藏
A study of mechanical properties of multi-layered graphene using modified Nose-Hoover based molecular dynamics基于改进的Nose-Hoover分子动力学的多层石墨烯力学性能研究
errCOMPUTATIONAL MATERIALS SCIENCE
IF3.3
err2016-05-01
err17
PREAI
errYu, Ching-Feng; Chen, Kun-Ling; Cheng, Hsien-Chie; Chen, Wen-Hwa
err分享
err收藏
First-principles density functional calculations of physical properties of orthorhombic Au2Al crystal正交Au2Al晶体物理性质的第一性原理密度泛函计算
errINTERMETALLICS
IF4.8
err2015-07-01
err26
PREAI
errChen, Wen-Hwa; Yu, Ching-Feng; Chiang, Kuo-Ning; Cheng, Hsien-Chie
err分享
err收藏
Structural, mechanical and thermodynamic properties of AuIn2 crystal under pressure: A first-principles density functional theory calculation
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2015-01-01
err19
PREAI
errYu, Ching-Feng; Cheng, Hsien-Chie; Chen, Wen-Hwa
err分享
err收藏
Physical, mechanical, thermodynamic and electronic characterization of Cu11In9 crystal using first-principles density functional theory calculation用第一性原理密度泛函理论计算Cu11In9晶体的物理、力学、热力学和电子特性
errCOMPUTATIONAL MATERIALS SCIENCE
IF3.3
err2014-01-01
err23
PREAI
errCheng, Hsien-Chie; Yu, Ching-Feng; Chen, Wen-Hwa
err分享
err收藏
Heat dissipation analysis and design of a board-level phased-array transmitter module for 60-GHz communication
errAPPLIED THERMAL ENGINEERING
IF6.9
err2013-04-01
err11
PREAI
errCheng, Hsien-Chie; Ciou, Wei-Ren; Chen, Wen-Hwa; Kuo, Jing-Lin; Lu, Hsin-Chia; Wu, Ruey-Beei
err分享
err收藏
First-principles density functional calculation of mechanical, thermodynamic and electronic properties of CuIn and Cu2In crystalsCuIn和Cu2In晶体力学、热力学和电子性质的第一性原理密度泛函计算
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2013-01-01
err69
PREAI
errCheng, Hsien-Chie; Yu, Ching-Feng; Chen, Wen-Hwa
err分享
err收藏
On the thermal characterization of an RGB LED-based white light module
errAPPLIED THERMAL ENGINEERING
IF6.9
err2012-05-01
err25
PREAI
errCheng, Hsien-Chie; Lin, Jia-Yun; Chen, Wen-Hwa
err分享
err收藏

研究方向

暂无研究方向
合作学者
合作期刊
R
Ruey‐Beei Wu
H 指数: 41 · 论文数: 316
Y
Yucheng Liu
H 指数: 35 · 论文数: 291
K
Kuo‐Ning Chiang
H 指数: 31 · 论文数: 345
W
Wen‐Hwa Chen
H 指数: 26 · 论文数: 179
T
Tao‐Chih Chang
H 指数: 23 · 论文数: 147
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