Naoteru Shigekawa - Publications, H-index & Citations

Naoteru Shigekawa

Osaka Metropolitan University

25H指数

333论文数

2.5K被引数

收录论文 21

发表时间

Direct Integration of Polycrystalline Diamond With 3C-SiC for Enhanced Thermal Management in GaN HEMTs: Impact of Grain Structure and Interface Engineering 多晶金刚石与3C-SiC的直接集成及其对GaN HEMTs热管理增强的影响：晶粒结构与界面工程的作用

Advanced Materials Technologies

IF6.2

2025-07-10

OAAI

Chiharu Moriyama; Zhe Cheng; Zifeng Huang; Yutaka Ohno; Koji Inoue; Yasuyoshi Nagai; Naoteru Shigekawa; Jianbo Liang

Probe beam deflection technique with liquid immersion for fast mapping of thermal conductance

APPLIED PHYSICS LETTERS

IF3.6

2024-01-22

PREAI

Sun, Jinchi; Cheng, Zhe; Liang, Jianbo; Shigekawa, Naoteru; Kawamura, Keisuke; Uratani, Hiroki; Sakaida, Yoshiki; Cahill, David G.

High Thermal Stability and Low Thermal Resistance of Large Area GaN/3C-SiC/Diamond Junctions for Practical Device Processes

SMALL

IF12.1

2023-11-14

OAAI

Kagawa, Ryo; Cheng, Zhe; Kawamura, Keisuke; Ohno, Yutaka; Moriyama, Chiharu; Sakaida, Yoshiki; Ouchi, Sumito; Uratani, Hiroki; Inoue, Koji; Nagai, Yasuyoshi; Shigekawa, Naoteru; Liang, Jianbo

Tuning the interlayer microstructure and residual stress of buffer-free direct bonding GaN/Si heterostructures

APPLIED PHYSICS LETTERS

IF3.6

2023-02-21

OAAI

Zhou, Yan; Zhou, Shi; Wan, Shun; Zou, Bo; Feng, Yuxia; Mei, Rui; Wu, Heng; Shigekawa, Naoteru; Liang, Jianbo; Tan, Pingheng; Kuball, Martin

Fabrication of GaN/Diamond Heterointerface and Interfacial Chemical Bonding State for Highly Efficient Device Design

ADVANCED MATERIALS

IF26.8

2021-09-09

OAAI

Liang, Jianbo; Kobayashi, Ayaka; Shimizu, Yasuo; Ohno, Yutaka; Kim, Seong-Woo; Koyama, Koji; Kasu, Makoto; Nagai, Yasuyoshi; Shigekawa, Naoteru

Water-soluble ZnSe/ZnS:Mn/ZnS quantum dots convert UV to visible light for improved Si solar cell efficiency

JOURNAL OF MATERIALS CHEMISTRY C

IF5.1

2021-01-01

OAAI

Nishimura, Hisaaki; Maekawa, Takaya; Enomoto, Kazushi; Shigekawa, Naoteru; Takagi, Tomomi; Sobue, Susumu; Kawai, Shoichi; Kim, DaeGwi

Chemical bonding at room temperature via surface activation to fabricate low-resistance GaAs/Si heterointerfaces 通过表面活化在室温下进行化学键合以制造低电阻GaAs/Si异质界面

APPLIED SURFACE SCIENCE

IF6.9

2020-09-01

OAAI

Ohno, Yutaka; Liang, Jianbo; Shigekawa, Naoteru; Yoshida, Hideto; Takeda, Seiji; Miyagawa, Reina; Shimizu, Yasuo; Nagai, Yasuyoshi

Effects of post bonding annealing on GaAs//Si bonding interfaces and its application for sacrificial-layer-etching based multijunction solar cells

SOLAR ENERGY MATERIALS AND SOLAR CELLS

IF6.3

2020-06-01

OAAI

Shigekawa, Naoteru; Kozono, Ryo; Yoon, Sanji; Hara, Tomoya; Liang, Jianbo; Yasui, Akira

Hard X-ray photoelectron spectroscopy investigation of annealing effects on buried oxide in GaAs/Si junctions by surface-activated bonding 硬x射线光电子能谱研究通过表面激活键合对GaAs/Si结中掩埋氧化物的退火影响

APPLIED SURFACE SCIENCE

IF6.9

2019-04-01

OAAI

Yamajo, Shoji; Yoon, Sanji; Liang, Jianbo; Sodabanlu, Hassanet; Watanabe, Kentaro; Sugiyama, Masakazu; Yasui, Akira; Ikenaga, Eiji; Shigekawa, Naoteru

Room-temperature direct bonding of diamond and Al

SCRIPTA MATERIALIA

IF5.6

2019-01-01

OAAI

Liang, Jianbo; Yamajo, Shoji; Kuball, Martin; Shigekawa, Naoteru

Realization of direct bonding of single crystal diamond and Si substrates

APPLIED PHYSICS LETTERS

IF3.6

2017-03-16

OAAI

Liang, Jianbo; Masuya, Satoshi; Kasu, Makoto; Shigekawa, Naoteru