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M

Mervi Paulasto‐Kröckel

aalto university

23H指数
176论文数
2.1K被引数
收录论文 30
发表时间
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A comparative study of non-destructive techniques for estimating dislocation densities in heteroepitaxial AlN layers异质外延AlN层位错密度估算的非破坏性技术比较研究
errJournal of Applied Physics
IF2.5
err2026-04-21
err0
PREAI
errPatocka, Marek; Tiwary, Nikhilendu; Suihkonen, Sami; Paulasto-Krockel, Mervi
err分享
err收藏
Comparison and Optimization of SLID Bonding for Die Attach on Various Substrate Types in Power Module Packaging ApplicationsSLID键合在功率模块封装应用中对不同基板类型的芯片贴装进行比较和优化
errIEEE Transactions on Components Packaging and Manufacturing Technology
IF3
err2026-01-01
err0
PREAI
errLiu, Shenyi; Vuorinen, Vesa; Schuh, Jannis; Albrecht, Jurgen; Paulasto-Krockel, Mervi
err分享
err收藏
Plasma Etching of Aluminum Nitride and Molybdenum in Multidimensional MEMS Structures铝氮化物和多晶硅在多维MEMS结构中的等离子体刻蚀
errADVANCED MATERIALS INTERFACES
IF4.4
err2025-11-01
err0
errOAAI
errNieminen, Tarmo; Ross, Glenn; Paulasto-krockel, Mervi
err分享
err收藏
Enhanced Vertical Sidewall Quality for Functional AlN Films in 3D Piezo MEMS Applications3D压电微机电系统应用中功能AlN薄膜的垂直侧壁质量提升
errAdvanced Electronic Materials
IF5.3
err2025-08-03
err0
errOAAI
errArsam Ali; Glenn Ross; Mervi Paulasto-Kröckel
err分享
err收藏
Thermally Conductive Buried Aluminum Nitride for Next Generation Silicon-on-Insulator高导热埋入式氮化铝用于下一代绝缘层上硅技术
errAdvanced Electronic Materials
IF5.3
err2025-07-13
err0
errOAAI
errJosef Stevanus Matondang; Nikhilendu Tiwary; Glenn Ross; Mervi Paulasto-Kröckel
err分享
err收藏
Fatigue Crack Networks in Die-Attach Layers of IGBT Modules Under a Power Cycling Test
errIEEE TRANSACTIONS ON POWER ELECTRONICS
IF6.5
err2024-12-01
err2
errOAAI
errLiu, Shenyi; Vuorinen, Vesa; Liu, Xing; Fredrikson, Olli; Brand, Sebastian; Tiwary, Nikhilendu; Lutz, Josef; Paulasto-Krockel, Mervi
err分享
err收藏
Scaling of piezoelectric in-plane NEMS: Towards nanoscale integration of AlN-based transducer on vertical sidewalls
errMATERIALS & DESIGN
IF7.9
err2024-08-01
err1
errOAAI
errGabrelian, Artem; Miikkulainen, Ville; Ross, Glenn; Paulasto-Krockel, Mervi
err分享
err收藏
Thermal Boundary Conductance of Direct Bonded Aluminum Nitride to Silicon Interfaces直接键合氮化铝与硅界面的热边界电导
errACS APPLIED ELECTRONIC MATERIALS
IF4.7
err2024-04-11
err2
errOAAI
errNieminen, Tarmo; Koskinen, Tomi; Kornienko, Vladimir; Ross, Glenn; Paulasto-Krockel, Mervi
err分享
err收藏
Investigative characterization of delamination at TiW-Cu interface in low-temperature bonded interconnects
errMATERIALS CHARACTERIZATION
IF5.5
err2024-03-01
err1
errOAAI
errGolim, Obert; Vuorinen, Vesa; Ross, Glenn; Suihkonen, Sami; Paulasto-Krockel, Mervi
err分享
err收藏
Co, In, and Co-In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics
errMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
IF7
err2023-08-01
err15
errOAAI
errEmadi, F.; Vuorinen, V.; Ross, G.; Paulasto-Krockel, M.
err分享
err收藏
Detection of In-Plane Movement in Electrically Actuated Microelectromechanical Systems Using a Scanning Electron Microscope
errMICROMACHINES
IF3
err2023-03-22
err2
errOAAI
errNieminen, Tarmo; Tiwary, Nikhilendu; Ross, Glenn; Paulasto-Krockel, Mervi
err分享
err收藏
Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C
errSCRIPTA MATERIALIA
IF5.6
err2023-01-01
err11
errOAAI
errGolim, Obert; Vuorinen, Vesa; Ross, Glenn; Wernicke, Tobias; Pawlak, Marta; Tiwary, Nikhilendu; Paulasto-Krockel, Mervi
err分享
err收藏
Unlocking the potential of piezoelectric films grown on vertical surfaces for inertial MEMS
errMATERIALS TODAY COMMUNICATIONS
IF4.5
err2022-12-01
err5
errOAAI
errGabrelian, Artem; Ross, Glenn; Bespalova, Kristina; Paulasto-Krockel, Mervi
err分享
err收藏
Microstructural and mechanical characterization of Cu/Sn SLID bonding utilizing Co as contact metallization layer
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2022-12-01
err11
errOAAI
errEmadi, F.; Vuorinen, V.; Mertin, S.; Widell, K.; Paulasto-Krockel, M.
err分享
err收藏
Investigation of the microstructural evolution and detachment of Co in contact with Cu-Sn electroplated silicon chips during solid-liquid interdiffusion bonding
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2022-01-01
err6
errOAAI
errEmadi, F.; Vuorinen, V.; Dong, H.; Ross, G.; Paulasto-Krockel, M.
err分享
err收藏
Aluminum Nitride to Silicon Direct Bonding for an Alternative Silicon-On-Insulator Platform
errACS APPLIED MATERIALS & INTERFACES
IF8.2
err2021-08-04
err10
errOAAI
errKaaos, Jani; Ross, Glenn; Paulasto-Krockel, Mervi
err分享
err收藏
Stability and residual stresses of sputtered wurtzite AlScN thin films
errPHYSICAL REVIEW MATERIALS
IF3.4
err2021-03-02
err30
errOAAI
errOsterlund, Elmeri; Ross, Glenn; Caro, Miguel A.; Paulasto-Krockel, Mervi; Hollmann, Andreas; Klaus, Manuela; Meixner, Matthias; Genzel, Christoph; Koppinen, Panu; Pensala, Tuomas; Zukauskaite, Agne; Trebala, Michal
err分享
err收藏
The impact of residual stress on resonating piezoelectric devices
errMATERIALS & DESIGN
IF7.9
err2020-11-01
err24
errOAAI
errRoss, Glenn; Dong, Hongqun; Karuthedath, Cyril Baby; Sebastian, Abhilash Thanniyil; Pensala, Tuomas; Paulasto-Krockel, Mervi
err分享
err收藏
Mechanical properties and reliability of aluminum nitride thin films
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2019-01-01
err42
PREAI
errOsterlund, Elmeri; Kinnunen, Jere; Rontu, Ville; Torkkeli, Altti; Paulasto-Krockel, Mervi
err分享
err收藏
The Role of Ultrafine Crystalline Behavior and Trace Impurities in Copper on Intermetallic Void Formation铜中的超细晶体行为和微量杂质对金属间空隙形成的作用
errACS APPLIED ELECTRONIC MATERIALS
IF4.7
err2018-12-10
err17
errOAAI
errRoss, Glenn; Malmberg, Per; Vuorinen, Vesa; Paulasto-Krockel, Mervi
err分享
err收藏

研究方向

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合作学者
合作期刊
江华 封面图
江华 (Hua Jiang)
H 指数: 62 · 论文数: 283
T
Timo Sajavaara
H 指数: 56 · 论文数: 293
P
Per Malmberg
H 指数: 54 · 论文数: 286
J
Johan Liu
H 指数: 46 · 论文数: 568
T
Tomi Laurila
H 指数: 43 · 论文数: 237
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