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刘洋 封面图

刘洋 (Yang Liu)

Shangluo University

27H指数
2.3K论文数
3.2K被引数
收录论文 50
发表时间
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The sintering behavior of electrosynthesized SnO2 powders电化学合成的SnO2粉末的烧结行为
errCeramics International
IF5.6
err2025-12-05
err0
PREAI
errNuo Cheng; Xiaokai Liu; Wenyu Zhang; Xina Liang; Huiyu Zhang; Hetao Zhao; Jianhang Zhang; Yuanpei Yang; Wenhui Bi; Mingzhen Zhang; Yang Liu; Benshuang Sun; Jilin He
err分享
err收藏
Identifying potentially modifiable risk factors associated with racially disparate postoperative outcomes following benign hysterectomy识别与良性子宫切除术术后种族差异结局相关的潜在可改变危险因素
errAmerican Journal of Obstetrics and Gynecology
IF8.4
err2025-12-02
err0
PREAI
errDarington Richardson; Courtney S. Lim; Yang Liu; Daniel M. Morgan; Sawsan As-Sanie; Sarah Santiago; Christopher X. Hong; Sara R. Till
err分享
err收藏
Preparation and Corrosion Resistance of Hydrothermal Coatings on LZ91 Mg–Li AlloyLZ91镁锂合金上水热涂层的制备与耐腐蚀性能
errCoatings 2025, Vol. 15, Page 1217
IF0
err2025-10-16
err0
errOAAI
errLiu Yang; Shiyuan Li; Hao Peng; Hao Jiang; Yong Wang; Yingping Guan; Hongwang Zhang
err分享
err收藏
Synthesis, structure and near-infrared luminescent property of a new 3D Nd (III) coordination polymer with terpyridyl carboxylate derivative and isophthalic acid ligands
errPOLYHEDRON
IF2.6
err2025-10-01
err1
PREAI
errYuan, Fei; Liu, Yang; Chen, Yong; Li, Tong; Xu, Zhen-Ning; Qiao, Cheng-Fang; Srivastava, Devyani
err分享
err收藏
Effect of Bi element on microstructure, strength and failure mechanism of Sn-Cu-In solder alloyBi元素对Sn-Cu-In焊料合金微观结构、强度及失效机制的影响
errMICROELECTRONICS RELIABILITY
IF1.9
err2025-09-01
err0
PREAI
errZhang, Jinlong; Zhang, Chenghao; Pan, Zhen; Li, Chun; Si, Xiaoqing; He, Zongjing; Liu, Yang; Cao, Jian
err分享
err收藏
Hierarchical Regulation to Design and Construct High Efficient Phenazine-Linked COFs for Photosynthesis H2O2 from Water and O2 or Air分级调控设计并构建高效吩嗪连接的COFs，用于以水和O2或空气为原料的光合作用H2O2生成。
errAdvanced Functional Materials
IF19
err2025-08-13
err0
PREAI
errYingchao Lai; Zhao-Di Yang; Guobin Ren; Wenshan Liu; Yang Liu; Rui Cao; Rui Zhang; Guiling Zhang; Wei Zheng
err分享
err收藏
Correlation analysis of PCB strain and solder joint stress for board-level packaging reliability under variable acceleration loadsPCB应变与焊点应力在变加速度载荷下对板级封装可靠性的相关性分析
errmaterials science materials in electronics
IF0
err2025-07-28
err0
PREAI
errJun Wang; Liwei Guo; Zehou Li; Xuening Jiang; Tianqi Xue; Jicun Lu; Yang Liu
err分享
err收藏
Multi-objective optimization for vibration suppression and weight reduction in composite sandwich shallow-spherical shells with functionally graded coating功能梯度涂层复合材料 sandwich 浅球壳的多目标振动抑制与减重优化
errMechanical Systems and Signal Processing
IF8.9
err2025-07-01
err0
PREAI
errJichuan Cao; Hui Li; Zhaoye Qin; Yang Liu; Haiyang Zhang; Xiangping Wang; Qingkai Han
err分享
err收藏
Xuetonlignans E-K, unusual spirobenzofuranoid dibenzocyclooctadiene lignans with hepatoprotective activity from the roots of Kadsura heteroclitaXuetonlignans E-K，具有保肝活性的独特螺苯并呋喃二苯环辛二烯木脂素，来源于异形南五味子根
errPhytochemistry
IF3.4
err2025-06-19
err0
PREAI
errWei Su; Xudong Zhou; Hanwen Yuan; Gang Fu; Shiqi Liu; Qingling Xie; Yupei Yang; Kang Zhou; Yang Liu; Bin Li; Wei Wang
err分享
err收藏
Corrigendum to ‘Research on the interface structure composite behavior and performance influence of Ni and Cr elements in Sn–Cu–Bi–In solder microstructure’ [Volume 36, May–June 2025, Pages 713–726]勘误：‘Research on the interface structure composite behavior and performance influence of Ni and Cr elements in Sn–Cu–Bi–In solder microstructure’ [Volume 36, May–June 2025, Pages 713–726]
errJournal of Materials Research and Technology
IF6.6
err2025-06-05
err0
errOAAI
errXiaochun Lv; Zhiyuan Wang; Zhen Pan; Chenghao Zhang; Lin Cao; Fenglian Sun; Yang Liu
err分享
err收藏
Research on the interface structure composite behavior and performance influence of Ni and Cr elements in Sn-Cu-Bi-in solder microstructureNi和Cr元素在Sn-Cu-Bi焊料微观结构中的界面结构复合行为及性能影响研究
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2025-05-01
err1
errOAAI
errLv, Xiaochun; Wang, Zhiyuan; Pan, Zhen; Zhang, Chenghao; Cao, Lin; Sun, Fenglian; Liu, Yang
err分享
err收藏
Field testing, analytical, and numerical assessments on the fatigue reliability on bridge suspender by considering the coupling effect of multiple pits现场测试、分析和数值评估在考虑多个坑洞耦合效应的桥梁吊索疲劳可靠性方面。
errSTRUCTURE AND INFRASTRUCTURE ENGINEERING
IF2.6
err2025-04-23
err0
PREAI
errHaiping Zhang; Yu Deng; Yuan Cao; Fanghuai Chen; Yuan Luo; Xinhui Xiao; Yang Deng; Yang Liu
err分享
err收藏
Hybrid functionals evaluate the n-type defects in Nb, Mo and Pt doped α-Ga2 O3
errMATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS
IF4.6
err2025-04-01
err0
PREAI
errChang, Jinyan; Yang, Liu; Hu, Gongwei; Fan, Shuaiwei
err分享
err收藏
Effects of proton irradiation on microstructure and mechanical properties of SAC305 solder jointsSAC305焊点在质子辐照下的微观结构与力学性能影响
errJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
IF2.8
err2025-03-08
err0
PREAI
errLiu, Yang; Jiang, Mengxia; Xia, Yangjing; Zhao, Xuewei; Meng, Fanchen; Li, Nannan; Xing, Chaoyang; Xue, Yuxiong
err分享
err收藏
Investigation of the Microstructures and Mechanical Properties of Sn-Cu-Bi-In-Ni Solders
errMATERIALS
IF3.2
err2025-02-16
err0
errOAAI
errLv, Xiaochun; Zhang, Chenghao; Liu, Yang; Pan, Zhen; Wang, Zhiyuan; Sun, Fenglian
err分享
err收藏
Fabrication and Modification of Hydrotalcite-Based Photocatalysts and Their Composites for CO2 Reduction: A Critical Review水滑石基光催化剂及其复合材料的制备与改性及其在CO2还原中的应用：综述
errCHEMSUSCHEM
IF6.6
err2025-02-09
err1
PREAI
errRehman, Munir Ur; Yin, Rong; Yang, Zhao-Di; Zhang, Guiling; Liu, Yang; Zhang, Feng-Ming; Yu, Cancan; Muhammad, Sheraz
err分享
err收藏
The role of indium in the microstructure and mechanical property of Sn-6.5Zn-0.08S solder铟在Sn-6.5Zn-0.08S焊料微观结构和力学性能中的作用
errJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
IF2.8
err2025-02-03
err0
PREAI
errHuang, Huizhen; Huang, Zhufa; Shuai, Gewang; Liu, Yang; Yu, Xinyuan
err分享
err收藏
Device packaging and integration optimization based on neural network method: Effect of microchannel structure on heat sink performance
errMATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
IF4.6
err2025-01-01
err1
PREAI
errLiu, Yang; Lv, Shiqing; Cui, Qiulang; Xia, Yangjing; Jiang, Mengxia; Lv, Jun; Huang, Mairui; Xue, Yuxiong
err分享
err收藏
Microscopic characteristics and corrosion rate modeling in galvanized high-strength steel wires
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2024-11-01
err0
errOAAI
errZhang, Haiping; Liu, Haojie; Chen, Fanghuai; Luo, Yuan; Xiao, Xinhui; Deng, Yang; Lu, Naiwei; Liu, Yang
err分享
err收藏
A two-dimensional four-quadrant assessment method to explore the spatiotemporal coupling and coordination relationship of human activities and ecological environment
errJOURNAL OF ENVIRONMENTAL MANAGEMENT
IF8.4
err2024-11-01
err2
PREAI
errLei, Kexin; Zhang, Huaiqing; Qiu, Hanqing; Liu, Yang; Wang, Jiansen; Hu, Xingtao; Cui, Zeyu; Zheng, Dongping
err分享
err收藏

研究方向

半导体封装材料及工艺开发精密焊接及微纳连接器件可靠性及失效物理多物理场仿真模拟数字李生及健康管理学术/社会任职中国焊接学会理事中国焊接协会理事SiC控制器功率模块封装电子封装互联焊点的服役行为及失效规律宽禁带半导体高耐热封装关键材料与技术器件应用第三代半导体SiC功率器件封装模块界面连接材料封装用高可靠无银焊料合金开发，企业委托项目，主持功率器件用高性能铜烧结接头铜颗粒烧结低温键合纳米银焊点微观结构与力学性能演变sintering mechanismAg nanoparticlenanoflakemolecular dynamics simulation低成本多形状烧结复合焊膏高温应用烧结互连强化方法2015至今毕业生去向
合作学者
合作期刊
A
Ahmad Umar
H 指数: 97 · 论文数: 980
张羽 封面图
张羽 (Yu Zhang)
H 指数: 82 · 论文数: 972
K
Katsuaki Suganuma
H 指数: 73 · 论文数: 908
曹
曹睿 (Rui Cao)
H 指数: 73 · 论文数: 569
张国良 封面图
张国良 (Guoliang Zhang)
H 指数: 70 · 论文数: 697
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