Per‐Erik Hellström - Publications, H-index & Citations

Per‐Erik Hellström

kth royal institute of technology

19H指数

146论文数

1.0K被引数

收录论文 9

发表时间

Suspended Germanium-on-Silicon Photonic Integrated Circuits Operating in the Long-Wave Infrared and Their Use for Ethanol Sensing 悬挂式硅基锗光子集成电路在长波红外区域工作及其在乙醇传感中的应用

ACS Photonics

IF6.7

2026-04-22

OAAI

Pen-Sheng Lin; Per-Erik Hellström; Charalampos Zervos; Frank Niklaus; Kristinn B. Gylfason

Optimization of GOPS-Based Functionalization Process and Impact of Aptamer Grafting on the Si Nanonet FET Electrical Properties as First Steps towards Thrombin Electrical Detection

NANOMATERIALS

IF4.3

2020-09-15

OAAI

Vallejo-Perez, Monica; Ternon, Celine; Spinelli, Nicolas; Morisot, Fanny; Theodorou, Christoforos; Jayakumar, Ganesh; Hellstrom, Per-Erik; Mouis, Mireille; Rapenne, Laetitia; Mescot, Xavier; Salem, Bassem; Stambouli, Valerie

Monolithic Wafer Scale Integration of Silicon Nanoribbon Sensors with CMOS for Lab-on-Chip Application

MICROMACHINES

IF3

2018-10-25

OAAI

Jayakumar, Ganesh; Hellstrom, Per-Erik; Ostling, Mikael

High-Deposition-Rate Atomic Layer Deposition of Thulium Oxide from TmCp3 and H2O

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2013-09-27

PREAI

Litta, Eugenio Dentoni; Hellstrom, Per-Erik; Henkel, Christoph; Valerio, Sven; Hallen, Anders; Ostling, Mikael

Reduced self-heating by strained silicon substrate engineering

APPLIED SURFACE SCIENCE

IF6.9

2008-07-01

PREAI

O'Neill, A.; Agaiby, R.; Olsen, S.; Yang, Y.; Hellstrom, P. -E.; Ostling, M.; Oehme, M.; Lyutovich, K.; Kasper, E.; Eneman, G.; Verheyen, P.; Loo, R.; Claeys, C.; Fiegna, C.; Sangiorgi, E.

Ni2Si nanowires of extraordinarily low resistivity

APPLIED PHYSICS LETTERS

IF3.6

2006-05-23

PREAI

Zhang, Z.; Lu, J.; Hellstrom, P.-E.; Ostling, M.; Zhang, S.-L.

Lateral encroachment of Ni-silicides in the source/drain regions on ultrathin silicon-on-insulator -: art. no. 253507

APPLIED PHYSICS LETTERS

IF3.6

2005-06-16

PREAI

Seger, J; Hellström, PE; Lu, J; Malm, BG; von Haartman, M; Ostling, M; Zhang, SL