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A 3D micromechanical compass
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DOI：10.1016/j.sna.2007.08.025.png)
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摘要
En 中文
We have designed and fabricated micromechanical magnetometers intended for a 3D electronic compass which could be embedded in portable devices. The sensors are based on the Lorentz force acting on a current-carrying coil, processed on a single crystal silicon resonator, and they are operated in vacuum to reach high enough Q values. Sensors for all cartesian components of the magnetic field vector can be processed on the same chip. The vibration amplitude is detected capacitively and the resonance is tracked by a phase-locked-loop circuit. The fabrication process is based on aligned direct bonding of a double side polished silicon wafer and a SOI wafer. Magnetometers measuring the field component along the chip surface have a flux density resolution of about 10nT/root Hz at-a coil, current of, 100 mu A. Magnetometers measuring the field component perpendicular to the chip surface are currently less sensitive with a flux density resolution of about 70 nT/root Hz. The standard deviation of the signal was less than 1% over a period of a few days. (C) 2007 Elsevier B.V. All rights reserved.
Keyword:
magnetometers
micromechanics
MEMS
resonant sensors
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期刊
IF:
4.9
论文数:
1.5W
被引数:
3.3W
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