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Erping Deng

Hefei University of Technology

19H-index
81Paper Count
1.0KCitation Count
Published Papers 24
Publication Date
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A Dynamic Current Sharing Method for Multichip SiC Power Modules Based on Mutual Couplings
errIEEE Transactions on Components Packaging and Manufacturing Technology
IF3
err2026-02-01
err0
PREAI
errLiu, Xun; Deng, Erping; Gao, Xu; Song, Yifan; Zhang, Xiao; Sun, Yameng; Li, Miao; Zhou, Yang; Ma, Kun; Liu, Sheng
errShare
errSave
State-of-the-art of Power Cycling Lifetime Models for Power Electronics
errCHINESE JOURNAL OF ELECTRICAL ENGINEERING
IF3.5
err2025-12-01
err0
PREAI
errWang, Weijie; Ren, Bin; Pan, Maoyang; Zhou, Yuhao; Deng, Erping; Huang, Yongzhang
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errSave
The Solder Layers Degradation of 6.5 kV IGBT Modules for Railway in Power Cycling Tests Considering Moisture Intrusion
errIEEE Transactions on Power Electronics
IF6.5
err2025-10-07
err0
PREAI
errYuxing Yan; Luhong Xie; Erping Deng; Weijie Wang; Qingtong He; Hongyu Sun; Maoyang Pan; Yongzhang Huang
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errSave
Influence of Moisture Absorption on Power Cycling Capability of IGBT Modules
errIEEE Transactions on Power Electronics
IF6.5
err2025-08-19
err0
PREAI
errQingtong He; Yuxing Yan; Erping Deng; Luhong Xie; Maoyang Pan; Hao Liu; Yongzhang Huang
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errSave
An Estimation Method for Lateral Temperature Gradient on Chip Surface of Power Semiconductor Devices
errieee journal on emerging and selected topics in circuits and systems
IF4.9
err2025-06-01
err0
PREAI
errMaoyang Pan; Erping Deng; Xia Wang; Yushan Zhao; Hongyu Sun; Yuxing Yan; Yunxia Dong; Yongzhang Huang
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errSave
Remaining Useful Lifetime Prediction Method of Power Modules Based on the Aging Characteristic Parameters
errIEEE TRANSACTIONS ON POWER ELECTRONICS
IF6.5
err2025-01-01
err0
PREAI
errXie, Luhong; Deng, Erping; Gu, Dianjie; Wang, Weijie; Liu, Hao; Zhang, Ying; Huang, Yongzhang
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errSave
Optimization and Validation of Current Sharing in IGBT Modules With Multichips in Parallel
errIEEE TRANSACTIONS ON POWER ELECTRONICS
IF6.5
err2024-12-01
err1
PREAI
errChang, Guiqin; Peng, Cheng; Liu, Yuanjian; Deng, Erping; Li, Xiang; Xiao, Qiang; Huang, Yongzhang
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errSave
An Alternative Junction-to-Case Thermal Resistance Test Method for High Power Press-Pack IGBTs
errIEEE TRANSACTIONS ON POWER ELECTRONICS
IF6.5
err2024-12-01
err0
PREAI
errSun, Hongyu; Sun, Yuan; Deng, Erping; Zhao, Yushan; Li, Weibang; Pan, Maoyang; Liu, Peng; Yan, Yuxing; Huang, Yongzhang
errShare
errSave
A Multi-Currents Method for Junction Temperature Separation of Cascode GaN
errIEEE TRANSACTIONS ON POWER ELECTRONICS
IF6.5
err2024-12-01
err0
PREAI
errWu, Lixin; Deng, Erping; Wang, Yanhao; Xu, Shengqian; Hua, Wenbo; Yang, Shaohua; Ding, Lijian
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errSave
Study on High Voltage Reverse Bias (HTRB) Test Method of 6.5 kV High-Voltage IGBT Modules for Railway
errIEEE TRANSACTIONS ON POWER ELECTRONICS
IF6.5
err2024-11-01
err0
PREAI
errYan, Yuxing; Wang, Weijie; Deng, Erping; Wang, Zuoyi; Wang, Yanhao; He, Qingtong; Sun, Hongyu; Huang, Yongzhang
errShare
errSave
Machine learning to estimate the bond strength of the corroded steel bar-concrete
errSTRUCTURAL CONCRETE
IF3.3
err2023-12-28
err10
PREAI
errWang, Kai-Lai; Li, Jingyi; Li, Li; Deng, E.; Zhang, Yang; Li, Zongli
errShare
errSave
Thermo-Hygroscopic-Mechanical Coupling Simulation Method for Power Electronics Under Power Cycling Test
errIEEE TRANSACTIONS ON POWER ELECTRONICS
IF6.5
err2023-09-01
err3
PREAI
errWang, Yanhao; Deng, Erping; Wu, Tianhua; Zhang, Yiming; Xie, Luhong; Huang, Yongzhang
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errSave
Difference Between the PWM and Standard DC Power Cycling Tests Based on the Finite-Element Simulation
errIEEE TRANSACTIONS ON POWER ELECTRONICS
IF6.5
err2023-07-01
err3
PREAI
errXie, Luhong; Wu, Lixin; Deng, Erping; Zhang, Ying; Zhao, Yushan; Huang, Yongzhang
errShare
errSave
Advanced Power Cycling Test Integrated With Voltage, Current, Temperature, and Humidity Stress
errIEEE TRANSACTIONS ON POWER ELECTRONICS
IF6.5
err2023-06-01
err6
PREAI
errWang, Yanhao; Deng, Erping; Wu, Lixin; Cao, Haiyang; Yan, Yuxing; Zeng, Pin; Zhang, Yiming; Zhao, Yushan; Huang, Yongzhang
errShare
errSave
Influence of the Uneven Temperature Distribution on the Electrode Warpage of PP IGBTs
errIEEE TRANSACTIONS ON POWER ELECTRONICS
IF6.5
err2023-04-01
err5
PREAI
errZhang, Yiming; Deng, Erping; Guo, Jiaqi; Zhao, Zhibin; Zhong, Yan; Zhang, Lei; Tang, Xinling; Cui, Xiang
errShare
errSave
Influence of Thermal Coupling on Lifetime Under Power Cycling Test
errIEEE TRANSACTIONS ON POWER ELECTRONICS
IF6.5
err2022-11-01
err10
PREAI
errZhao, Yushan; Deng, Erping; Pan, Maoyang; Zhang, Yiming; Huang, Yongzhang
errShare
errSave
Junction-to-Case Thermal Resistance Measurement and Analysis of Press-Pack IGBTs Under Double-Side Cooling Condition
errIEEE TRANSACTIONS ON POWER ELECTRONICS
IF6.5
err2022-07-01
err17
PREAI
errChen, Jie; Deng, Erping; Zhang, Yiming; Huang, Yongzhang
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errSave
Temperature Influence on the Accuracy of the Transient Dual Interface Method for the Junction-to-Case Thermal Resistance Measurement
errIEEE TRANSACTIONS ON POWER ELECTRONICS
IF6.5
err2021-07-01
err20
PREAI
errDeng, Erping; Chen, Weinan; Heimler, Patrick; Lutz, Josef
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errSave
Sequential Vce(T) Method for the Accurate Measurement of Junction Temperature Distribution Within Press-Pack IGBTs
errIEEE TRANSACTIONS ON POWER ELECTRONICS
IF6.5
err2021-04-01
err25
PREAI
errZhang, Yiming; Deng, Erping; Zhao, Zhibin; Chen, Jie; Zhao, Yushan; Guo, Jiaqi; Cui, Xiang
errShare
errSave
Correction of Delay-Time-Induced Maximum Junction Temperature Offset During Electrothermal Characterization of IGBT Devices
errIEEE TRANSACTIONS ON POWER ELECTRONICS
IF6.5
err2021-03-01
err22
PREAI
errDeng, Erping; Borucki, Ludger; Lutz, Josef
errShare
errSave

Research Directions

No research directions
Co-authors
Cooperation Journals
李
李敬源 (Jingyuan Li)
H-index: 54 · Papers: 512
P
Peng Zhang
H-index: 41 · Papers: 605
孙媛 cover
孙媛 (Yuan Sun)
H-index: 39 · Papers: 263
J
Josef Lutz
H-index: 35 · Papers: 286
X
Xiang Cui
H-index: 34 · Papers: 543
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