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D
Dinh-Phuc Tran
National Taipei University of Technology
19
H-index
115
Paper Count
1.3K
Citation Count
0
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Published Papers
54
Publication Date
Publication Date
Impact Factor
Citations
High-Strength Nanotwinned Copper Combined with Silicon/Silicon Nitride/Graphite Anode for High-Performance Lithium-Ion Battery
Materials
IF
3.2
2026-06-10
0
OA
AI
Fu-Chian Chen; Rahmandhika Firdauzha Hary Hernandha; Dinh-Phuc Tran; Jeng-Kuei Chang; Chih Chen
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Ultra-high mechanical strength and high electrical conductivity nanotwinned CuPd foils
Journal of Materials Research and Technology
IF
6.6
2026-05-26
0
OA
AI
Fu-Chian Chen; Dinh-Phuc Tran; Chih Chen
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Recent Advances in Nanostructured Copper: From Fabrication to Applications
Crystal Growth & Design
IF
0
2026-05-18
0
OA
AI
Dinh-Phuc Tran; Kang-Ping Lee; Huai-En Lin; Yu-Wen Hung; Mai-Phuong La; Chih Chen
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Structure–Property Relationship in Ultra-Thin Copper Foils: From Nanotwinned to Fine-Grained Microstructures
Materials 2026, Vol. 19, Page 36
IF
3.2
2025-12-22
0
OA
AI
Fu-Chian Chen; Dinh-Phuc Tran; Chih Chen
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Fabrication and characterization of (111)-oriented nanocrystalline copper for low-temperature Cu-to-Cu bonding
Materials Characterization
IF
5.5
2025-11-26
0
PRE
AI
Chen-Ning Li; Dinh-Phuc Tran; Kang-Ping Lee; Yu-Tao Yang; Chih Chen
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Design strategy and thermal stability characterization of high-strength nanotwinned Cu-Ni foils
Results in Engineering
IF
7.9
2025-08-16
0
OA
AI
Kang-Ping Lee; Ming-Han Lu; Dinh-Phuc Tran; Chun-Ting Ke; Pin-Chia Chen; Po-Jui Su; Chih Chen
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Regulating intermetallic compound growth and bridging in SnAg solder under electromigration stress through Ni addition and sn crystallographic orientation-grain size
Journal of Advanced Joining Processes
IF
4
2025-06-01
0
OA
AI
Dinh-Phuc Tran; Ya-Ting Xiao; Mai-Phuong La; Shi-Chi Yang; Chih Chen
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Temperature-dependent mechanical properties and fracture behaviors of copper foils with different microstructures
MATERIALS CHARACTERIZATION
IF
5.5
2025-06-01
0
PRE
AI
Chen, Bo-Yan; Tran, Dinh-Phuc; Lee, Kang-Ping; Chen, Yun-Hsuan
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Breaking strength-conductivity trade-off in nanotwinned Cu by Fe Co-electroplating and its thermal stability characterization
MATERIALS CHARACTERIZATION
IF
5.5
2025-05-01
1
PRE
AI
Tran, Dinh-Phuc; Chen, Bo-Yan; La, Mai-Phuong; Lee, Kang-Ping
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Fabrication of nanoporous-nanotwinned Cu by dealloying and its application for high-power device packaging
JOURNAL OF ALLOYS AND COMPOUNDS
IF
6.3
2025-04-01
0
PRE
AI
Lu, Wan-Hsin; Tran, Dinh-Phuc; Lin, Huai-En; Shen, Guan-You; Chen, Bo-Yan; Lee, Kang-Ping; Tsai, Chih-Chi; Lin, Yi-Quan; Tu, K. N.; Chen, Chih
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Efficient Cu/SiO2 hybrid bonding through alkaline surface modification for 3D IC integration
APPLIED SURFACE SCIENCE
IF
6.9
2025-04-01
0
PRE
AI
Chen, Yu-An; Ong, Jia-Juen; Tran, Dinh-Phuc; Chiu, Wei-Lan; Chang, Hsiang-Hung; Hsu, Wei-You; Chen, Chih
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Design of surface topography for fabricating nanotwinned copper/ polyimide hybrid joints using in-situ heating atomic force microscopy
APPLIED SURFACE SCIENCE
IF
6.9
2025-03-01
0
PRE
AI
He, Pin-Syuan; Tran, Dinh-Phuc; Shie, Kai-Cheng; Chen, Chih
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Surface modification of nanotwinned copper and SiCN using N2 and Ar plasma activation
APPLIED SURFACE SCIENCE
IF
6.9
2025-03-01
0
PRE
AI
Lee, Rou-Jun; He, Pin-Syuan; Tran, Dinh-Phuc; Chiu, Wei-Lan; Chang, Hsiang-Hung; Lee, Chang-Chun; Chen, Chih
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Fabrication and properties of high thermal stability nanocrystalline Cu for low temperature Cu-Cu bonding
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF
6.6
2025-03-01
0
OA
AI
Huang, Jian-Yuan; Tran, Dinh-Phuc; Lee, Kang-Ping; Lin, Yi-Quan; Kuo, Emile; Chen, Tsung-Chuan; Chen, Yao-Tsung; Chung, Stream
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Twin boundary and grain boundary engineering to enhance mechanical strength of nanotwinned Cu
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
IF
7
2025-02-01
0
PRE
AI
Lee, Kang-Ping; Tran, Dinh-Phuc; Chen, Bo-Yan; Lin, Yi-Quan; Huang, Jian-Yuan; Chen, Pin-Chia; Chen, Chih
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Evolutions of interfacial microstructures in Cu/SiO2 hybrid joints during temperature cycling tests
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF
6.6
2024-11-01
0
OA
AI
Ong, Jia-Juen; Tran, Dinh-Phuc; Huang, Hua-Jing; Chiu, Wei-Lan; Yang, Shih-Chi; Wu, Wen-Wei; Chiang, Hsiang-Hung; Chen, Chih
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Enhanced cross-interfacial growth by thickening transition layers and tailoring grain size of columnar nanotwinned Cu films
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF
6.6
2024-11-01
0
OA
AI
Chen, Kuan-Ju; Hsieh, Chang-Chih; Tran, Dinh-Phuc; Chen, Chih
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Enhanced thermal expansion with nanocrystalline Cu in SiO2 vias for hybrid bonding
APPLIED SURFACE SCIENCE
IF
6.9
2024-11-01
2
PRE
AI
Lin, Huai-En; Tran, Dinh-Phuc; Chiu, Wei-Lan; Chang, Hsiang-Hung; Chen, Chih
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Enhancement of anti-oxidation and tensile strength of nanotwinned Cu foils by preferential Ni electrodeposition
ELECTROCHIMICA ACTA
IF
5.6
2024-10-01
0
PRE
AI
Lee, Kang-Ping; Tran, Dinh-Phuc; Chen, Bo-Yan; Lin, Yi-Quan; Li, Chen-Ning; Huang, Jian-Yuan; Chen, Hsuan-Chih; Chen, Ruei-Yu; Chen, Chih
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Effect of heterogeneous microstructures on mechanical properties of thin gradient nanotwinned copper foils
SURFACE & COATINGS TECHNOLOGY
IF
6.1
2024-10-01
0
PRE
AI
Hung, Yu-Wen; Tran, Dinh-Phuc; Lin, Yi-Quan; Chen, Chih
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Research Directions
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Co-authors
Cooperation Journals
K
K. N. Tu
H-index: 81 · Papers: 651
K
K. N. Tu
H-index: 61 · Papers: 206
J
Jeng‐Kuei Chang
H-index: 59 · Papers: 456
陈
陈远
(Yuan Chen)
H-index: 53 · Papers: 424
C
Chih Chen
H-index: 50 · Papers: 401
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