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SaveShare Save Share Save Share Save Share Save Share Save Share Save Share Save Share Save Share Save Share Save Share Save Share Save Share Save Share Save Share Save Share Save The Big Chip: Challenge, model and architecture
Han, Yinhe; Xu, Haobo; Lu, Meixuan; Wang, Haoran; Huang, Junpei; Wang, Ying; Wang, Yujie; Min, Feng; Liu, Qi; Liu, Ming; Sun, Ninghui Share Save FPIA: Communication-Aware Multi-Chiplet Integration With Field-Programmable Interconnect Fabric on Reusable Silicon InterposerJiao, Bo; Xu, Lei; Yu, Xinyu; Yang, Haitao; Zhu, Haozhe; Wang, Yu; Zhu, Jundong; Wen, Dexin; Wang, Lingli; Tao, Jun; Chen, Chixiao; Han, Yinhe; Liu, Qi; Sun, Ninghui; Liu, Ming Share Save Share Save 
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