Vesa Vuorinen - Publications, H-index & Citations

Vesa Vuorinen

aalto university

27H指数

157论文数

4.1K被引数

收录论文 10

发表时间

Comparison and Optimization of SLID Bonding for Die Attach on Various Substrate Types in Power Module Packaging Applications SLID键合在功率模块封装应用中对不同基板类型的芯片贴装进行比较和优化

IEEE Transactions on Components Packaging and Manufacturing Technology

IF3

2026-01-01

PREAI

Liu, Shenyi; Vuorinen, Vesa; Schuh, Jannis; Albrecht, Jurgen; Paulasto-Krockel, Mervi

Fatigue Crack Networks in Die-Attach Layers of IGBT Modules Under a Power Cycling Test

IEEE TRANSACTIONS ON POWER ELECTRONICS

IF6.5

2024-12-01

OAAI

Liu, Shenyi; Vuorinen, Vesa; Liu, Xing; Fredrikson, Olli; Brand, Sebastian; Tiwary, Nikhilendu; Lutz, Josef; Paulasto-Krockel, Mervi

Bonding of ceramics to silver-coated titanium-A combined theoretical and experimental study

JOURNAL OF BIOMEDICAL MATERIALS RESEARCH PART B-APPLIED BIOMATERIALS

IF3.4

2024-04-27

OAAI

Vuorinen, Vesa; Kouhia, Reijo; Koenoenen, Mauno; Kivilahti, Jorma K.

Investigative characterization of delamination at TiW-Cu interface in low-temperature bonded interconnects

MATERIALS CHARACTERIZATION

IF5.5

2024-03-01

OAAI

Golim, Obert; Vuorinen, Vesa; Ross, Glenn; Suihkonen, Sami; Paulasto-Krockel, Mervi

Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C

SCRIPTA MATERIALIA

IF5.6

2023-01-01

OAAI

Golim, Obert; Vuorinen, Vesa; Ross, Glenn; Wernicke, Tobias; Pawlak, Marta; Tiwary, Nikhilendu; Paulasto-Krockel, Mervi

The Role of Ultrafine Crystalline Behavior and Trace Impurities in Copper on Intermetallic Void Formation 铜中的超细晶体行为和微量杂质对金属间空隙形成的作用

ACS APPLIED ELECTRONIC MATERIALS

IF4.7

2018-12-10

OAAI

Ross, Glenn; Malmberg, Per; Vuorinen, Vesa; Paulasto-Krockel, Mervi

Blistering mechanisms of atomic-layer-deposited AlN and Al2O3 films

APPLIED PHYSICS LETTERS

IF3.6

2017-10-04

OAAI

Broas, Mikael; Jiang, Hua; Graff, Andreas; Sajavaara, Timo; Vuorinen, Vesa; Paulasto-Krockel, Mervi

Chemically Stable Atomic-Layer-Deposited Al2O3 Films for Processability

ACS OMEGA

IF4.3

2017-07-11

OAAI

Broas, Mikael; Kanninen, Olli; Vuorinen, Vesa; Tilli, Markku; Paulasto-Krockel, Mervi

Void formation and its impact on Cu-Sn intermetallic compound formation 空隙的形成及其对cu-sn金属间化合物形成的影响

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2016-08-01

PREAI

Ross, Glenn; Vuorinen, Vesa; Paulasto-Krockel, Mervi

Combined Thermodynamic-Kinetic Analysis of the Interfacial Reactions between Ni Metallization and Various Lead-Free Solders

MATERIALS

IF3.2

2009-11-11

OAAI

Laurila, Tomi; Vuorinen, Vesa

研究方向