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科言猫学术研究的AI总结
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N

Nishikawa, Hiroshi

University of Osaka

0H指数
6论文数
0被引数
收录论文 3
发表时间
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Non-destructive orientation tracking of individual β-Sn grains in die-attach solder joints单个β-Sn晶粒在芯片键合焊点中的无损取向追踪
errJournal of Synchrotron Radiation
IF3
err2026-05-01
err1
PREAI
errKim, Jaemyung; Hayashi, Yujiro; Tatsumi, Hiroaki; Nishikawa, Hiroshi; Yabashi, Makina
err分享
err收藏
Improvement in impact property of SAC305 BGA solder joint through epoxy addition通过环氧树脂添加改善SAC305 BGA焊点的冲击性能
errMicroelectronics Reliability
IF1.9
err2026-01-01
err0
PREAI
errZhang, Peng; Xue, Songbai; Liu, Lu; Wang, Jianhao; Huo, Fupeng; Nishikawa, Hiroshi
err分享
err收藏
Size effect on shear performance of microscale ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints under current stressing微尺度球栅阵列结构Cu/Sn-3.0Ag-0.5Cu/Cu焊点在电流应力下的尺寸效应对剪切性能的影响
errSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
err2026-01-01
err0
PREAI
errWang, Bo; Ke, Zhanglong; Chen, Zimeng; Li, Wangyun; Huang, Wei; He, Siliang; Pan, Kailin; Nishikawa, Hiroshi
err分享
err收藏

研究方向

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合作学者
合作期刊
M
Makina Yabashi
H 指数: 75 · 论文数: 1.0K
王
王波 (Bo Wang)
H 指数: 16 · 论文数: 90
W
Wang, Jianhao
H 指数: 0 · 论文数: 1
L
Li, Wangyun
H 指数: 0 · 论文数: 1
X
Xue, Songbai
H 指数: 0 · 论文数: 1
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