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收藏Selective atomic-level etching using two heating procedures, infrared irradiation and ion bombardment, for next-generation semiconductor device manufacturing
Shinoda, K.; Miyoshi, N.; Kobayashi, H.; Miura, M.; Kurihara, M.; Maeda, K.; Negishi, N.; Sonoda, Y.; Tanaka, M.; Yasui, N.; Izawa, M.; Ishii, Y.; Okuma, K.; Saldana, T.; Manos, J.; Ishikawa, K.; Hori, M.
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收藏100-Gbps CMOS transceiver for multilane optical backplane system with a 1.3 cm2 footprint
Takemoto, Takashi; Yuki, Fumio; Yamashita, Hiroki; Tsuji, Shinji; Lee, Yong; Adachi, Koichiro; Shinoda, Kazunori; Matsuoka, Yasunobu; Kogo, Kenji; Nishimura, Shinji; Nido, Masaaki; Namiwaka, Masahiko; Kaneko, Taro; Sugimoto, Takara; Kurata, Kazuhiko
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收藏Components and Interconnection Technologies for Photonic-Assisted Routers Toward Green Networks
Nishimura, Shinji; Shinoda, Kazunori; Lee, Yong; Ono, Goichi; Fukuda, Koji; Yuki, Fumio; Takemoto, Takashi; Toyoda, Hidehiro; Yamada, Masaki; Tsuji, Shinji; Ikeda, Naoya
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收藏12.5-Gb/s direct modulation up to 115 °C in 1.3-μm InGaAlAs-MQW RWG DFB lasers with notch-free grating structure
Nakahara, K; Tsuchiya, T; Kitatani, T; Shinoda, K; Kikawa, T; Hamano, F; Fujisaki, S; Taniguchi, T; Nomoto, E; Sawada, M; Yuasa, T
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