Martin Schneider‐Ramelow

Technical University of Berlin

23H指数

271论文数

1.9K被引数

收录论文 12

发表时间

Washability of E-Textiles: Washing Behavior of Textile Integrated Circuits Depending on Textile Substrate, Circuit Material and Integration Method 电子纺织品的可洗性: 取决于纺织品基材，电路材料和集成方法的纺织品集成电路的洗涤行为

ADVANCED FUNCTIONAL MATERIALS

IF19

2024-12-01

PREAI

Rotzler, Sigrid; von Krshiwoblozki, Malte; Kallmayer, Christine; Schneider-Ramelow, Martin

Cu-Cu Thermocompression Bonding with a Self-Assembled Monolayer as Oxidation Protection for 3D/2.5D System Integration 具有自组装单层的cu-cu热压键合作为3D/2.5D系统集成的氧化保护

MICROMACHINES

IF3

2023-06-30

OAAI

Lykova, Maria; Panchenko, Iuliana; Schneider-Ramelow, Martin; Suga, Tadatomo; Mu, Fengwen; Buschbeck, Roy

PCB Embedding Technology for the Miniaturization of complex electronic systems

2022 IEEE CPMT SYMPOSIUM JAPAN (ICSJ)

IF0

2022-11-09

PREAI

Loeher, Thomas; Schuetze, David; Spanier, Malte; Ostmann, Andreas; Schneider-Ramelow, Martin

Low-Temperature Processible Highly Conducting Pastes for Printed Electronics Applications 用于印刷电子应用的可低温加工的高导电性浆料

ADVANCED ENGINEERING MATERIALS

IF3.3

2022-02-07

OAAI

Scenev, Vitalij; Szalapak, Jerzy; Werft, Lukas; Hoelck, Ole; Jakubowska, Malgorzata; von Krshiwoblozki, Malte; Kallmayer, Christine; Schneider-Ramelow, Martin

Recent Advances and Challenges of Nanomaterials-Based Hydrogen Sensors

MICROMACHINES

IF3

2021-11-21

OAAI

Wang, Bei; Sun, Ling; Schneider-Ramelow, Martin; Lang, Klaus-Dieter; Ha-Duong Ngo

Die-Attach Bonding with Etched Micro Brass Metal Pigment Flakes for High-Power Electronics Packaging

ACS APPLIED ELECTRONIC MATERIALS

IF4.7

2021-09-23

PREAI

Bhogaraju, Sri Krishna; Kotadia, Hiren R.; Conti, Fosca; Mauser, Armin; Rubenbauer, Thomas; Bruetting, Robert; Schneider-Ramelow, Martin; Elger, Gordon

On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers

MICROMACHINES

IF3

2020-05-31

OAAI

Roshanghias, Ali; Dreissigacker, Marc; Scherf, Christina; Bretthauer, Christian; Rauter, Lukas; Zikulnig, Johanna; Braun, Tanja; Becker, Karl-F.; Rzepka, Sven; Schneider-Ramelow, Martin

Development and Characterization of a Novel Low-Cost Water-Level and Water Quality Monitoring Sensor by Using Enhanced Screen Printing Technology with PEDOT:PSS

MICROMACHINES

IF3

2020-04-30

OAAI

Wang, Bei; Baeuscher, Manuel; Hu, Xiaodong; Woehrmann, Markus; Becker, Katharina; Juergensen, Nils; Hubl, Moritz; Mackowiak, Piotr; Schneider-Ramelow, Martin; Lang, Klaus-Dieter; Ngo, Ha-Duong

Preparing WEEE plastics for recycling - How optimal particle sizes in pre-processing can improve the separation efficiency of high quality plastics

RESOURCES CONSERVATION AND RECYCLING

IF10.9

2020-03-01

OAAI

Maisel, Franziska; Chancerel, Perrine; Dimitrova, Gergana; Emmerich, Johanna; Nissen, Nils F.; Schneider-Ramelow, Martin

Investigation of the Mechanical and Electrical Properties of Elastic Textile/Polymer Composites for Stretchable Electronics at Quasi-Static or Cyclic Mechanical Loads

MATERIALS

IF3.2

2019-11-01

OAAI

Dils, Christian; Werft, Lukas; Walter, Hans; Zwanzig, Michael; von Krshiwoblozki, Malte; Schneider-Ramelow, Martin

Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration 扇出晶圆和面板级封装作为异构集成的封装平台

MICROMACHINES

IF3

2019-05-23

OAAI

Braun, Tanja; Becker, Karl-Friedrich; Hoelck, Ole; Voges, Steve; Kahle, Ruben; Dreissigacker, Marc; Schneider-Ramelow, Martin

Design and Application of a High-G Piezoresistive Acceleration Sensor for High-Impact Application

MICROMACHINES

IF3

2018-05-28

OAAI

Hu, Xiaodong; Mackowiak, Piotr; Baeuscher, Manuel; Ehrmann, Oswin; Lang, Klaus-Dieter; Schneider-Ramelow, Martin; Linke, Stefan; Ngo, Ha-Duong

研究方向