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T

Tadatomo Suga

meisei university

51H指数
871论文数
1.1W被引数
收录论文 110
发表时间
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Low-temperature Ru/SiO2 thermocompression hybrid bonding via quaternary plasma-enabled cooperative surface activation低温Ru/SiO2热压混合键合通过四元等离子体辅助协同表面活化
errJournal of Alloys and Compounds
IF6.3
err2026-09-23
err0
PREAI
errYufei Bai; Xinze Li; Jia Yang; Erni Shao; Guining Yu; Tadatomo Suga; Chenxi Wang
err分享
err收藏
Low-Temperature Ru–Ru Hybrid Bonding: Ar/H2 Plasma and NH4OH Synergistic Activation for Ultrahigh Density Interconnection
errACS Applied Materials and Interfaces
IF8.2
err2026-02-05
err0
PREAI
errYufei Bai; Jia Yang; Xinze Li; Qiushi Kang; Ziyang Xiu; Tadatomo Suga; Chenxi Wang
err分享
err收藏
Ammonia vapor-assisted plasma activation and mechanism study for high-strength direct wafer bonding of silicon oxide
errMaterials Characterization
IF5.5
err2026-01-30
err0
PREAI
errXiaohui Yuan; Shijiao Xu; Linjie Liu; Xiangyu Zhou; Kaimeng Liu; Yujie Han; Tadatomo Suga; Chenxi Wang
err分享
err收藏
Hydroxide-catalyzed bonding of sapphire and quartz glass enabled by plasma activation
errMaterials Letters
IF2.7
err2026-01-15
err0
PREAI
errErni Shao; Han Yan; Yan Ma; Yufei Bai; Yanhong Tian; Tadatomo Suga; Chenxi Wang
err分享
err收藏
Plasma-assisted polishing with silicon and silica plates: Comparison of interaction mechanism and achievement of atomically flat surfaces on single- and polycrystalline diamond硅和二氧化硅基板辅助的等离子体抛光：单晶和多晶金刚石相互作用机制与原子级平整表面制备的比较
errJournal of Materials Processing Technology
IF7.5
err2025-12-16
err0
PREAI
errJiayuan Dong; Sota Sugihara; Kafumi Fujiwara; Rongyan Sun; Yuji Ohkubo; Junsha Wang; Tadatomo Suga; Kazuya Yamamura
err分享
err收藏
Low-Temperature In Situ Bonding with Ion-Free Neutral Species and Ammonia-Enhanced Activation for Microfluidic Chip Architecture低温原位键合，采用无离子中性物种和氨增强活化，用于微流控芯片结构
errACS Applied Materials & Interfaces
IF8.2
err2025-08-01
err0
PREAI
errXiaohui Yuan; Linjie Liu; Fanfan Niu; Xiaoyun Qi; Xiangyu Zhou; Guining Yu; Tadatomo Suga; Chenxi Wang
err分享
err收藏
Synergistic Plasma Activation-Enabled Low-Temperature Cobalt/SiO2 Hybrid Bonding without Oxide Interfaces协同等离子体激活辅助的低温度Co/SiO2混合键合，无需氧化物界面
errACS APPLIED MATERIALS & INTERFACES
IF8.2
err2025-03-14
err0
PREAI
errQi, XY; Bai, YF; Yan, H; Yuan, XH; Ma, Y; Suga, T; Wang, CX
err分享
err收藏
Enhanced Cu-Cu bonding for ultrahigh-density interconnection: Co passivation bonding with non-oxidation interfaces用于超高密度互连的增强cu-cu键合: 具有非氧化界面的Co钝化键合
errAPPLIED SURFACE SCIENCE
IF6.9
err2025-03-01
err0
PREAI
errQi, Xiaoyun; Yan, Han; Yuan, Xiaohui; Bai, Yufei; Suga, Tadatomo; Wang, Chenxi
err分享
err收藏
Boosting non-oxide interfacial Co/SiO2 hybrid bonding by selective surface activation通过选择性表面活化增强非氧化物界面Co/SiO2杂化键合
errINTERNATIONAL JOURNAL OF EXTREME MANUFACTURING
IF21.3
err2025-01-23
err1
errOAAI
errQi, Xiaoyun; Zhou, Shicheng; Ma, Yan; Suga, Tadatomo
err分享
err收藏
From surface activation to microfluidic heat pipes: An innovative in-situ wafer level heterogenous bonding method
errCHEMICAL ENGINEERING JOURNAL
IF13.2
err2024-10-01
err0
PREAI
errYuan, Xiaohui; Liu, Linjie; Niu, Fanfan; Qi, Xiaoyun; An, Baitao; Suga, Tadatomo; Wang, Chenxi
err分享
err收藏
Wafer-level InP-Si covalent bonding and defect-free heterointerface for photonic quantum systems
errAPPLIED SURFACE SCIENCE
IF6.9
err2024-10-01
err2
PREAI
errKang, Qiushi; Niu, Fanfan; Li, Ge; Liu, Kaimeng; Suga, Tadatomo; Wang, Chenxi
err分享
err收藏
InP/LiNbO3 Covalent Heterointerface Construction via an Asymmetric Plasma Activation Strategy for Hybrid Integrated Quantum Systems
errACS APPLIED MATERIALS & INTERFACES
IF8.2
err2024-08-28
err0
PREAI
errKang, Qiushi; Yan, Han; Niu, Fanfan; Liu, Kaimeng; Suga, Tadatomo; Wang, Chenxi
err分享
err收藏
Elucidating the formation mechanisms of the parasitic channel with buffer-free GaN/Si hetero-bonding structures
errAPPLIED PHYSICS LETTERS
IF3.6
err2024-05-09
err0
PREAI
errShi, Hangning; Ding, Jiaxin; Qin, Qingcheng; Yi, Ailun; Sun, Jialiang; Suga, Tadatomo; Yi, Juemin; Wang, Jianfeng; Xu, Ke; Zhou, Min; Huang, Kai; You, Tiangui; Ou, Xin
err分享
err收藏
Low-temperature Cu/SiO2 hybrid bonding based on Ar/H2 plasma and citric acid cooperative activation for multi-functional chip integration
errAPPLIED SURFACE SCIENCE
IF6.9
err2024-03-01
err16
PREAI
errNiu, Fanfan; Wang, Xiaobing; Yang, Shuhan; Xu, Shijiao; Zhang, Yuyang; Suga, Tadatomo; Wang, Chenxi
err分享
err收藏
Thermal Transport Properties of β-Ga2O3 Thin Films on Si and SiC Substrates Fabricated by an Ion-Cutting Process
errACS APPLIED ELECTRONIC MATERIALS
IF4.7
err2024-02-27
err7
PREAI
errXu, Wenhui; Zhao, Tiancheng; Zhang, Lianghui; Liu, Kang; Sun, Huarui; Qu, Zhenyu; You, Tiangui; Yi, Ailun; Huang, Kai; Han, Genquan; Mu, Fengwen; Suga, Tadatomo; Ou, Xin; Hao, Yue
err分享
err收藏
Room temperature wafer bonding through conversion of polysilazane into SiO2
errSCIENTIFIC REPORTS
IF3.9
err2024-01-13
err3
errOAAI
errTakeuchi, Kai; Suga, Tadatomo; Higurashi, Eiji
err分享
err收藏
Defect evolution in GaN thin film heterogeneously integrated with CMOS-compatible Si(100) substrate by ion-cutting technology
errSCIENCE CHINA-INFORMATION SCIENCES
IF7.6
err2023-10-20
err2
PREAI
errShi, Hangning; Yi, Ailun; Ding, Jiaxin; Liu, Xudong; Qin, Qingcheng; Yi, Juemin; Hu, Junjie; Wang, Miao; Cai, Demin; Wang, Jianfeng; Xu, Ke; Mu, Fengwen; Suga, Tadatomo; Heller, Rene; Wang, Mao; Zhou, Shengqiang; Xu, Wenhui; Huang, Kai; You, Tiangui; Ou, Xin
err分享
err收藏
Cu-Cu Thermocompression Bonding with a Self-Assembled Monolayer as Oxidation Protection for 3D/2.5D System Integration具有自组装单层的cu-cu热压键合作为3D/2.5D系统集成的氧化保护
errMICROMACHINES
IF3
err2023-06-30
err6
errOAAI
errLykova, Maria; Panchenko, Iuliana; Schneider-Ramelow, Martin; Suga, Tadatomo; Mu, Fengwen; Buschbeck, Roy
err分享
err收藏
Room temperature bonding of Au assisted by self-assembled monolayer
errAPPLIED PHYSICS LETTERS
IF3.6
err2023-02-03
err2
PREAI
errTakeuchi, Kai; Wang, Junsha; Kim, Beomjoon; Suga, Tadatomo; Higurashi, Eiji
err分享
err收藏
ReS2 on GaN Photodetector Using H+ Ion-Cut Technology
errACS OMEGA
IF4.3
err2022-12-20
err9
errOAAI
errLiu, Xinke; Zhou, Jie; Luo, Jiangliu; Shi, Hangning; You, Tiangui; Ou, Xin; Botcha, Venkatadivakar; Mu, Fengwen; Suga, Tadatomo; Wang, Xinzhong; Huang, Shuangwu
err分享
err收藏

研究方向

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合作学者
合作期刊
周豪慎 封面图
周豪慎 (Haoshen Zhou)
H 指数: 143 · 论文数: 816
C
Chengkuo Lee
H 指数: 112 · 论文数: 958
张建 封面图
张建 (Jian Zhang)
H 指数: 108 · 论文数: 2.2K
N
Nam‐Trung Nguyen
H 指数: 101 · 论文数: 1.1K
D
David G. Cahill
H 指数: 96 · 论文数: 555
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