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Two-dimensional wafer-scale chemical mechanical planarization models based on lubrication theory and mass transport

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2019-12-06

173

PREAI

Sundararajan, S; Thakurta, DG; Schwendeman, DW; Murarka, SP; Gill, WN

Chemical mechanical polishing mechanisms of low dielectric constant polymers in copper slurries

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2019-12-06

PREAI

Borst, CL; Thakurta, DG; Gill, WN; Gutmann, RJ

A time dependent dielectric breakdown model for field accelerated low-k breakdown due to copper ions

APPLIED PHYSICS LETTERS

IF3.6

2007-12-06

PREAI

Achanta, Ravi S.; Plawsky, Joel L.; Gill, William N.

A model for the etching of nanoporous silica in C4F8 plasmas based on pore geometry and porosity effects

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2005-01-01

PREAI

Cho, WJ; Rodriguez, O; Saxena, R; Ojha, M; Chanta, RA; Plawsky, JL; Gill, WN

Polymer penetration and pore sealing in nanoporous silica by CHF3 plasma exposure

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2005-01-01

PREAI

Cho, WJ; Saxena, R; Rodriguez, O; Ojha, M; Achanta, R; Plawsky, JL; Gill, WN

Effects of sintering on dielectric constants of mesoporous silica

JOURNAL OF NON-CRYSTALLINE SOLIDS

IF3.5

2004-12-01

PREAI

Cho, WJ; Saxena, R; Rodriguez, O; Achanta, R; Plawsky, JL; Gill, WN

Diffusion of copper in nanoporous dielectric films

INDUSTRIAL & ENGINEERING CHEMISTRY RESEARCH

IF3.9

2004-10-08

PREAI

Rodriguez, O; Saxena, R; Cho, WJ; Plawsky, JL; Gill, WN

Kinetic model for the pyrolysis of polysiloxane polymers to ceramic composites

AICHE JOURNAL

IF4

2004-04-16

PREAI

Plawsky, JL; Wang, F; Gill, WN

Surface kinetics model for SiLK chemical mechanical polishing

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2002-01-01

PREAI

Borst, CL; Thakurta, DG; Gill, WN; Gutmann, RJ

Interactions between nanoporous silica and copper

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2002-01-01

PREAI

Rogojevic, S; Jain, A; Gill, WN; Plawsky, JL

Three-dimensional chemical mechanical planarization slurry flow model based on lubrication theory

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2001-01-01

PREAI

Thakurta, DG; Borst, CL; Schwendeman, DW; Gutmann, RJ; Gill, WN

Thermal conductivity study of porous low-k dielectric materials

APPLIED PHYSICS LETTERS

IF3.6

2000-07-03

PREAI

Hu, C; Morgen, M; Ho, PS; Jain, A; Gill, WN; Plawsky, JL; Wayner, PC

Stability and transport characteristics of reverse osmosis membranes using cyanide rinse waters

JOURNAL OF MEMBRANE SCIENCE

IF9

1998-04-01

PREAI

Goel, M; Agrawal, V; Kulkarni, AK; Cramer, SM; Gill, WN

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