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S

Sanghyun Jin

sogang university

6H指数
17论文数
125被引数
收录论文 4
发表时间
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Single-Mask Embedded Trace Redistribution Layer Technology Using Grayscale Lithography基于灰度光刻的单层掩膜嵌入式引线重分布层技术
errIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
IF3
err2025-10-01
err0
PREAI
errDo, Wonchul; Jin, Sanghyun; Choi, Insoo; Jeong, Jinho
err分享
err收藏
Effect of Pulse Current and Pre-annealing on Thermal Extrusion of Cu in Through-Silicon via (TSV)
errFRONTIERS IN CHEMISTRY
IF4.2
err2020-10-14
err10
errOAAI
errKim, Youjung; Jin, Sanghyun; Park, Kimoon; Lee, Jinhyun; Lim, Jae-Hong; Yoo, Bongyoung
err分享
err收藏
The Effect of Copper Dissolution in Acidic Electrolyte on the Formation of Nanotwin in Pulse Electrodeposited Copper
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2014-05-31
err9
errOAAI
errSeo, Sungho; Jin, Sanghyun; Wang, Geon; Yoo, Bongyoung
err分享
err收藏
Through-Silicon-Via (TSV) Filling by Electrodeposition of Cu with Pulse Current at Ultra-Short Duty Cycle
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2013-12-18
err55
PREAI
errJin, Sanghyun; Wang, Geon; Yoo, Bongyoung
err分享
err收藏

研究方向

暂时未获取到该数据
合作学者
合作期刊
B
Bongyoung Yoo
H 指数: 38 · 论文数: 252
J
Jae‐Hong Lim
H 指数: 35 · 论文数: 220
J
Jinho Jeong
H 指数: 19 · 论文数: 129
J
Jinhyun Lee
H 指数: 14 · 论文数: 82
W
WonChul Do
H 指数: 8 · 论文数: 21
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