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科言猫学术研究的AI总结
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C

C. C. Goldsmith

international business machines (ibm)

16H指数
64论文数
1.3K被引数
收录论文 4
发表时间
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Blech effect in Pb-free flip chip solder joint无铅倒装芯片焊点中的Blech效应
errAPPLIED PHYSICS LETTERS
IF3.6
err2009-01-08
err22
PREAI
errLu, Minhua; Shih, Da-Yuan; Lauro, Paul; Goldsmith, Charles
err分享
err收藏
Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free soldersSn晶粒取向对高Sn基无铅焊料电迁移退化机制的影响
errAPPLIED PHYSICS LETTERS
IF3.6
err2008-05-29
err232
PREAI
errLu, Minhua; Shih, Da-Yuan; Lauro, Paul; Goldsmith, Charles; Henderson, Donald W.
err分享
err收藏
Thermal stress evolution in embedded Cu/low-k dielectric composite features
errAPPLIED PHYSICS LETTERS
IF3.6
err2006-07-07
err12
PREAI
errMurray, Conal E.; Goldsmith, Charles C.; Shaw, Thomas M.; Doyle, James P.; Noyan, I. C.
err分享
err收藏
Finite size effects in stress analysis of interconnect structures
errAPPLIED PHYSICS LETTERS
IF3.6
err2004-08-02
err29
errOAAI
errNoyan, IC; Murray, CE; Chey, JS; Goldsmith, CC
err分享
err收藏

研究方向

暂时未获取到该数据
合作学者
合作期刊
T
T. M. Shaw
H 指数: 42 · 论文数: 230
D
Da‐Yuan Shih
H 指数: 32 · 论文数: 88
I
I. C. Noyan
H 指数: 29 · 论文数: 204
陆
陆敏华 (Minhua Lu)
H 指数: 27 · 论文数: 205
C
Conal E. Murray
H 指数: 25 · 论文数: 170
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