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Dinh-Phuc Tran

National Taipei University of Technology

19H指数
115论文数
1.3K被引数
收录论文 54
发表时间
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High-Strength Nanotwinned Copper Combined with Silicon/Silicon Nitride/Graphite Anode for High-Performance Lithium-Ion Battery高强度纳米孪晶铜结合硅/氮化硅/石墨阳极，用于高性能锂离子电池
errMaterials
IF3.2
err2026-06-10
err0
errOAAI
errFu-Chian Chen; Rahmandhika Firdauzha Hary Hernandha; Dinh-Phuc Tran; Jeng-Kuei Chang; Chih Chen
err分享
err收藏
Ultra-high mechanical strength and high electrical conductivity nanotwinned CuPd foils超高的机械强度和高电导率纳米孪晶CuPd箔
errJournal of Materials Research and Technology
IF6.6
err2026-05-26
err0
errOAAI
errFu-Chian Chen; Dinh-Phuc Tran; Chih Chen
err分享
err收藏
Recent Advances in Nanostructured Copper: From Fabrication to Applications纳米结构铜的最新进展：从制备到应用
errCrystal Growth & Design
IF0
err2026-05-18
err0
errOAAI
errDinh-Phuc Tran; Kang-Ping Lee; Huai-En Lin; Yu-Wen Hung; Mai-Phuong La; Chih Chen
err分享
err收藏
Structure–Property Relationship in Ultra-Thin Copper Foils: From Nanotwinned to Fine-Grained Microstructures超薄铜箔的结构-性能关系：从纳米孪晶到细晶微观结构
errMaterials 2026, Vol. 19, Page 36
IF3.2
err2025-12-22
err0
errOAAI
errFu-Chian Chen; Dinh-Phuc Tran; Chih Chen
err分享
err收藏
Fabrication and characterization of (111)-oriented nanocrystalline copper for low-temperature Cu-to-Cu bonding(111)-取向纳米晶铜的制备与表征，用于低温铜-铜键合
errMaterials Characterization
IF5.5
err2025-11-26
err0
PREAI
errChen-Ning Li; Dinh-Phuc Tran; Kang-Ping Lee; Yu-Tao Yang; Chih Chen
err分享
err收藏
Design strategy and thermal stability characterization of high-strength nanotwinned Cu-Ni foils高强纳米孪晶Cu-Ni箔的设计策略与热稳定性表征
errResults in Engineering
IF7.9
err2025-08-16
err0
errOAAI
errKang-Ping Lee; Ming-Han Lu; Dinh-Phuc Tran; Chun-Ting Ke; Pin-Chia Chen; Po-Jui Su; Chih Chen
err分享
err收藏
Regulating intermetallic compound growth and bridging in SnAg solder under electromigration stress through Ni addition and sn crystallographic orientation-grain size通过Ni添加和Sn晶体学取向-晶粒尺寸调控电迁移应力下SnAg焊料中金属间化合物的生长与桥接
errJournal of Advanced Joining Processes
IF4
err2025-06-01
err0
errOAAI
errDinh-Phuc Tran; Ya-Ting Xiao; Mai-Phuong La; Shi-Chi Yang; Chih Chen
err分享
err收藏
Temperature-dependent mechanical properties and fracture behaviors of copper foils with different microstructures铜箔的微观结构对温度依赖的力学性能和断裂行为的影响
errMATERIALS CHARACTERIZATION
IF5.5
err2025-06-01
err0
PREAI
errChen, Bo-Yan; Tran, Dinh-Phuc; Lee, Kang-Ping; Chen, Yun-Hsuan
err分享
err收藏
Breaking strength-conductivity trade-off in nanotwinned Cu by Fe Co-electroplating and its thermal stability characterization纳米孪晶铜中通过Fe共电镀实现的抗拉强度-导电率权衡及其热稳定性表征
errMATERIALS CHARACTERIZATION
IF5.5
err2025-05-01
err1
PREAI
errTran, Dinh-Phuc; Chen, Bo-Yan; La, Mai-Phuong; Lee, Kang-Ping
err分享
err收藏
Fabrication of nanoporous-nanotwinned Cu by dealloying and its application for high-power device packaging通过脱合金法制备纳米多孔-纳米孪晶Cu及其在高功率器件封装中的应用
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2025-04-01
err0
PREAI
errLu, Wan-Hsin; Tran, Dinh-Phuc; Lin, Huai-En; Shen, Guan-You; Chen, Bo-Yan; Lee, Kang-Ping; Tsai, Chih-Chi; Lin, Yi-Quan; Tu, K. N.; Chen, Chih
err分享
err收藏
Efficient Cu/SiO2 hybrid bonding through alkaline surface modification for 3D IC integration
errAPPLIED SURFACE SCIENCE
IF6.9
err2025-04-01
err0
PREAI
errChen, Yu-An; Ong, Jia-Juen; Tran, Dinh-Phuc; Chiu, Wei-Lan; Chang, Hsiang-Hung; Hsu, Wei-You; Chen, Chih
err分享
err收藏
Design of surface topography for fabricating nanotwinned copper/ polyimide hybrid joints using in-situ heating atomic force microscopy
errAPPLIED SURFACE SCIENCE
IF6.9
err2025-03-01
err0
PREAI
errHe, Pin-Syuan; Tran, Dinh-Phuc; Shie, Kai-Cheng; Chen, Chih
err分享
err收藏
Surface modification of nanotwinned copper and SiCN using N2 and Ar plasma activation
errAPPLIED SURFACE SCIENCE
IF6.9
err2025-03-01
err0
PREAI
errLee, Rou-Jun; He, Pin-Syuan; Tran, Dinh-Phuc; Chiu, Wei-Lan; Chang, Hsiang-Hung; Lee, Chang-Chun; Chen, Chih
err分享
err收藏
Fabrication and properties of high thermal stability nanocrystalline Cu for low temperature Cu-Cu bonding高热稳定性纳米晶Cu的制备及其低温Cu-Cu键合性能
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2025-03-01
err0
errOAAI
errHuang, Jian-Yuan; Tran, Dinh-Phuc; Lee, Kang-Ping; Lin, Yi-Quan; Kuo, Emile; Chen, Tsung-Chuan; Chen, Yao-Tsung; Chung, Stream
err分享
err收藏
Twin boundary and grain boundary engineering to enhance mechanical strength of nanotwinned Cu
errMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
IF7
err2025-02-01
err0
PREAI
errLee, Kang-Ping; Tran, Dinh-Phuc; Chen, Bo-Yan; Lin, Yi-Quan; Huang, Jian-Yuan; Chen, Pin-Chia; Chen, Chih
err分享
err收藏
Evolutions of interfacial microstructures in Cu/SiO2 hybrid joints during temperature cycling tests
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2024-11-01
err0
errOAAI
errOng, Jia-Juen; Tran, Dinh-Phuc; Huang, Hua-Jing; Chiu, Wei-Lan; Yang, Shih-Chi; Wu, Wen-Wei; Chiang, Hsiang-Hung; Chen, Chih
err分享
err收藏
Enhanced cross-interfacial growth by thickening transition layers and tailoring grain size of columnar nanotwinned Cu films通过加厚过渡层和调整柱状纳米孪晶Cu膜的晶粒尺寸来增强跨界面生长
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2024-11-01
err0
errOAAI
errChen, Kuan-Ju; Hsieh, Chang-Chih; Tran, Dinh-Phuc; Chen, Chih
err分享
err收藏
Enhanced thermal expansion with nanocrystalline Cu in SiO2 vias for hybrid bonding
errAPPLIED SURFACE SCIENCE
IF6.9
err2024-11-01
err2
PREAI
errLin, Huai-En; Tran, Dinh-Phuc; Chiu, Wei-Lan; Chang, Hsiang-Hung; Chen, Chih
err分享
err收藏
Enhancement of anti-oxidation and tensile strength of nanotwinned Cu foils by preferential Ni electrodeposition
errELECTROCHIMICA ACTA
IF5.6
err2024-10-01
err0
PREAI
errLee, Kang-Ping; Tran, Dinh-Phuc; Chen, Bo-Yan; Lin, Yi-Quan; Li, Chen-Ning; Huang, Jian-Yuan; Chen, Hsuan-Chih; Chen, Ruei-Yu; Chen, Chih
err分享
err收藏
Effect of heterogeneous microstructures on mechanical properties of thin gradient nanotwinned copper foils
errSURFACE & COATINGS TECHNOLOGY
IF6.1
err2024-10-01
err0
PREAI
errHung, Yu-Wen; Tran, Dinh-Phuc; Lin, Yi-Quan; Chen, Chih
err分享
err收藏

研究方向

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合作学者
合作期刊
K
K. N. Tu
H 指数: 81 · 论文数: 651
K
K. N. Tu
H 指数: 61 · 论文数: 206
J
Jeng‐Kuei Chang
H 指数: 59 · 论文数: 458
陈
陈远 (Yuan Chen)
H 指数: 53 · 论文数: 428
C
Chih Chen
H 指数: 50 · 论文数: 401
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