Kai-Cheng Shie

National Yang Ming Chiao Tung University

12H指数

27论文数

416被引数

收录论文 14

发表时间

Elucidating electromigration-induced void failures in Ni/SnAg/Ni solder microbumps using 3D X-ray laminographic inspections 利用3D X射线层析扫描技术揭示Ni/SnAg/Ni焊料微凸点中电迁移诱发的空洞失效

Materials Characterization

IF5.5

2025-09-24

PREAI

Shih-Chi Yang; Chi-Hau Wu; Kai-Cheng Shie; King-Ning Tu; Chih Chen

Design of surface topography for fabricating nanotwinned copper/ polyimide hybrid joints using in-situ heating atomic force microscopy

APPLIED SURFACE SCIENCE

IF6.9

2025-03-01

PREAI

He, Pin-Syuan; Tran, Dinh-Phuc; Shie, Kai-Cheng; Chen, Chih

Chemical mechanical planarization of nanotwinned copper/polyimide for low temperature hybrid bonding

JOURNAL OF ELECTROANALYTICAL CHEMISTRY

IF4.1

2024-09-01

PREAI

He, Pin-Syuan; Tu, Chun-Wei; Shie, Kai-Cheng; Liu, Chien-Yu; Tsai, Hsin-Yu; Tran, Dinh-Phuc; Chen, Chih

High-Bonding-Strength Polyimide Films Achieved via Thermal Management and Surface Activation 通过热管理和表面活化实现高粘合强度聚酰亚胺薄膜

NANOMATERIALS

IF4.3

2023-05-08

OAAI

He, Pin-Syuan; Tran, Dinh-Phuc; Kuo, Ting-Yu; Hsu, Wei-You; Lin, Huai-En; Shie, Kai-Cheng; Chen, Chih

Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing 退火过程中 (111) 优选纳米孪晶铜的应力松弛和晶粒生长行为

NANOMATERIALS

IF4.3

2023-02-13

OAAI

Lai, Jyun-Yu; Tran, Dinh-Phuc; Yang, Shih-Chi; Tseng, I-Hsin; Shie, Kai-Cheng; Leu, Jihperng; Chen, Chih

Non-destructive micro analysis of electromigration failures in solder microbumps using 3D X-ray computed tomography

MATERIALS CHARACTERIZATION

IF5.5

2022-12-01

PREAI

Tran, Dinh-Phuc; Lin, Tzu-Wen; Shie, Kai-Cheng; Chen, Chih

Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints 锡晶粒取向对SnAg焊点中Ni金属化电迁移诱导溶解的影响

MATERIALS

IF3.2

2022-10-13

OAAI

Hsu, Po-Ning; Lee, Dai-Lung; Dinh-Phuc Tran; Shie, Kai-Cheng; Tsou, Nien-Ti; Chen, Chih

Enhancement of fatigue resistance by recrystallization and grain growth to eliminate bonding interfaces in Cu-Cu joints

SCIENTIFIC REPORTS

IF3.9

2022-07-30

OAAI

Ong, Jia-Juen; Tran, Dinh-Phuc; Lan, Man-Chi; Shie, Kai-Cheng; Hsu, Po-Ning; Tsou, Nien-Ti; Chen, Chih

Failures of Cu-Cu Joints under Temperature Cycling Tests Cu-cu接头在温度循环试验下的失效

MATERIALS

IF3.2

2022-07-15

OAAI

Hsu, Po-Ning; Shie, Kai-Cheng; Tran, Dinh-Phuc; Tsou, Nien-Ti; Chen, Chih

Artificial intelligence deep learning for 3D IC reliability prediction

SCIENTIFIC REPORTS

IF3.9

2022-04-25

OAAI

Hsu, Po-Ning; Shie, Kai-Cheng; Chen, Kuan-Peng; Tu, Jing-Chen; Wu, Cheng-Che; Tsou, Nien-Ti; Lo, Yu-Chieh; Chen, Nan-Yow; Hsieh, Yong-Fen; Wu, Mia; Chen, Chih; Tu, King-Ning

Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces 使用 (111) 取向的Cu表面进行低接触电阻的低温Cu/SiO2混合键合

MATERIALS

IF3.2

2022-03-03

OAAI

Ong, Jia-Juen; Chiu, Wei-Lan; Lee, Ou-Hsiang; Chiang, Chia-Wen; Chang, Hsiang-Hung; Wang, Chin-Hung; Shie, Kai-Cheng; Yang, Shih-Chi; Tran, Dinh-Phuc; Tu, King-Ning; Chen, Chih

A kinetic model of copper-to-copper direct bonding under thermal compression 热压缩下铜与铜直接键合的动力学模型

JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T

IF6.6

2021-11-01

OAAI

Shie, Kai-Cheng; Gusak, A. M.; Tu, K. N.; Chen, Chih

Effect of Bonding Strength on Electromigration Failure in Cu-Cu Bumps

MATERIALS

IF3.2

2021-10-25

OAAI

Shie, Kai-Cheng; Hsu, Po-Ning; Li, Yu-Jin; Tu, K. N.; Chen, Chih