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Topographically selective deposition
DOI:10.1063/1.5065801.png)
摘要
En 中文
In this paper, we present a topographically Selective Deposition process which allows the vertical only coating of three-dimensional (3D) nano-structures. This process is based on the alternate use of plasma enhanced atomic layer deposition (PEALD) and sputtering carried out in a PEALD reactor equipped with a radio-frequency substrate biasing kit. A so-called super-cycle has been conceived, which consists of 100 standard deposition cycles followed by an anisotropic argon sputtering induced by the application of a 13.56 MHz biasing waveform to the substrate holder in the PEALD chamber. This sputtering step removes the deposited material on horizontal surfaces only, and the sequential deposition/etch process allows effective deposition on vertical surfaces only. Thus, it opens up a route for topographically selective deposition, which can be of interest for the fabrication of 3D vertical Metal-Insulator-Metal devices. (C) Published under license by AIP Publishing.
Keyword:
ATOMIC LAYER DEPOSITION
METAL-OXIDES
HIGH-QUALITY
ALD
NANOSTRUCTURES
GROWTH
ION
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期刊
IF:
3.6
论文数:
10.4W
被引数:
17.8W
机构
引用论文
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Area-Selective Atomic Layer Deposition of SiO2 Using Acetylacetone as a Chemoselective Inhibitor in an ABC-Type Cycle在ABC型循环中使用乙酰丙酮作为化学选择性抑制剂进行SiO2的区域选择性原子层沉积
ACS NANO
IF16
Self-assembled monolayer resist for atomic layer deposition of HfO2 and ZrO2 high-κ gate dielectrics

