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Topographically selective deposition

delete2019-01-28
delete14
PRE
AI
A
A. Chaker
C
C. Vallée
P
Pesce, V.
S
S. Belahcen
R
R. Vallat
R
R. Gassilloud
N
N. Possémé
M
M. Bonvalot
A
A. Bsiesy *
DOI:10.1063/1.5065801delete
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摘要

摘要

En 中文
In this paper, we present a topographically Selective Deposition process which allows the vertical only coating of three-dimensional (3D) nano-structures. This process is based on the alternate use of plasma enhanced atomic layer deposition (PEALD) and sputtering carried out in a PEALD reactor equipped with a radio-frequency substrate biasing kit. A so-called super-cycle has been conceived, which consists of 100 standard deposition cycles followed by an anisotropic argon sputtering induced by the application of a 13.56 MHz biasing waveform to the substrate holder in the PEALD chamber. This sputtering step removes the deposited material on horizontal surfaces only, and the sequential deposition/etch process allows effective deposition on vertical surfaces only. Thus, it opens up a route for topographically selective deposition, which can be of interest for the fabrication of 3D vertical Metal-Insulator-Metal devices. (C) Published under license by AIP Publishing.
Keyword:
ATOMIC LAYER DEPOSITION
METAL-OXIDES
HIGH-QUALITY
ALD
NANOSTRUCTURES
GROWTH
ION
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期刊

Applied Physics Letters 封面图
Applied Physics Letters
IF:
3.6
论文数:
10.4W
被引数:
17.8W

机构

U
universite grenoble alpes (uga)
学者数:
2.1W
论文数: 1.5W
被引数: 23
C
communaute universite grenoble alpes
学者数:
3.5W
论文数: 2.7W
被引数: 29
引用论文

引用论文

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