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T

Tohru Sugahara

Kyoto Institute of Technology
H指数:41
被引数:5,605

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Online Thermal Resistance and Reliability Characteristic Monitoring of Power Modules With Ag Sinter Joining and Pb, Pb-Free Solders During Power Cycling Test by SiC TEG Chip

SiC TEG芯片在功率循环测试过程中在线监测具有Ag烧结连接和无铅焊料的功率模块的热阻和可靠性特性

2021-05-0154
PREAI
Formation of Metal-Organic Decomposition Derived Nanocrystalline Structure Titanium Dioxide by Heat Sintering and Photosintering Methods for Advanced Coating Process, and Its Volatile Organic Compounds' Gas-Sensing Properties

用于先进涂层工艺的热烧结和光烧结方法形成金属有机分解衍生的纳米晶结构二氧化钛及其挥发性有机化合物的气敏性能

2020-05-3113
PREAI