未登录Breakthrough in 19 nm half-pitch W damascene interconnects using nanoimprint lithography and atomic-scale processing采用纳米压印光刻和原子级加工实现19 nm半间距W镶嵌互连技术的突破
Suzuki, Kenta; Ueda, Tetsuya; Kasashima, Yuji; Mizubayashi, Wataru; Okada, Naoya; Ota, Hiroyuki; Fukasawa, Masanaga; Hayashi, Yoshihiro; Ishida, Masaki; Funayoshi, Tomomi; Hiura, Hiromi; Kagawa, Masayuki; Hasegawa, Noriyasu; Yamamoto, Kiyohito
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收藏1X nm half-pitch pattern transfer using a spin-on glass and amorphous carbon hard mask for nanoimprint lithography采用旋涂玻璃和非晶碳硬质掩模进行1X nm半节距图案转移的纳米压印光刻
Suzuki, Kenta; Hamamoto, Ryosuke; Kasashima, Yuji; Ueda, Tetsuya; Mizubayashi, Wataru; Fukasawa, Masanaga; Hayashi, Yoshihiro; Ishida, Masaki; Funayoshi, Tomomi; Hiura, Hiromi; Kagawa, Masayuki; Hasegawa, Noriyasu; Yamamoto, Kiyohito
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