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Andrew C. Kummel

university of california

47H指数
415论文数
9.8K被引数
收录论文 174
发表时间
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Homogeneous N-polar AlScN sputtered films using a single AlSc alloy target and in-situ AlSc template采用单一AlSc合金靶和原位AlSc模板制备的均匀N极性AlScN溅射薄膜
errApplied Surface Science
IF6.9
err2026-10-03
err0
PREAI
errSeongUk Yun; Dohyun Go; Xinyu Wang; Ping-Che Lee; Prabhakar R. Bandaru; Andrew C. Kummel
err分享
err收藏
Electron Backscatter Diffraction for Quantitative Evaluation of Copper Surface Cleanliness before Hybrid Bonding电子背散射衍射用于混合键合前铜表面清洁度的定量评估
errACS Applied Electronic Materials
IF4.7
err2026-05-02
err0
PREAI
errJit Dutta; Cheng-Hsuan Kuo; Dipayan Pal; Ping-Che Lee; Diego Contreras Mora; Hyeokin Ko; Shuran Sheng; Raymond Hung; Carl V. Thompson; Andrew C. Kummel
err分享
err收藏
Gallium oxide in field effect transistors-A perspective氧化镓在场效应晶体管中的应用展望
errJOURNAL OF VACUUM SCIENCE & TECHNOLOGY A
IF2.1
err2026-05-01
err0
PREAI
errPasslack, Matthias; Droopad, Ravi; Thayne, Iain; Kummel, Andrew
err分享
err收藏
Grain-Size Engineering in Vapor-Deposited ZIF-8 MOF: Low-Leakage Low-k Films with Enhanced Breakdown Field气相沉积ZIF-8 MOF中的晶粒尺寸调控：低泄漏低介电常数薄膜及其增强的击穿场强
errACS Applied Materials and Interfaces
IF8.2
err2026-03-04
err0
PREAI
errDipayan Pal; Jit Dutta; Diego Contreras Mora; Jing Mu; Xinyu Wang; Dohyun Go; Amy E. Ross; Andrew C. Kummel
err分享
err收藏
Cyclic Oxidation–Reduction Cleaning for Microstructural and Chemical Restoration of Copper after Chemical Mechanical Polishing循环氧化-还原清洗用于化学机械抛光后铜的微观结构和化学恢复
errACS Applied Electronic Materials
IF4.7
err2026-02-11
err0
PREAI
errCheng-Hsuan Kuo; Jit Dutta; Hyeokin Ko; Dipayan Pal; Madison Manley; Rohan Sahay; Danish Baig; Muhannad Bakir; Charles H. Winter; Carl V. Thompson; Andrew C. Kummel
err分享
err收藏
Inverse Hybrid Bonding for D2D/D2W Heterogeneous Integration With 20 μm Pitch倒装混合键合技术用于间距为20微米的设备对设备/设备对晶圆异质集成
errIEEE Transactions on Components Packaging and Manufacturing Technology
IF3
err2026-02-01
err0
PREAI
errManley, Madison; Sahay, Rohan; Pal, Dipayan; Victor, Ashita; Baig, Danish; Dutta, Jit; Kummel, Andrew C.; Bakir, Muhannad S.
err分享
err收藏
Chiplet Encapsulation and Planarization with 100 μm Deep Gaps Using AlN Powder Spray plus Sputter Hybrid Deposition使用AlN粉末喷涂与溅射混合沉积技术实现含100 μm深间隙的芯粒封装与平坦化
errAdvanced Engineering Materials
IF3.3
err2026-02-01
err0
PREAI
errGo, Dohyun; Victor, Ashita; Wang, Alex; Choi, Mingeun; Song, Hyun Seok; Yun, Seong Uk; Pal, Dipayan; Lee, Ping-Che; Dutta, Jit; Ryu, Jungho; Kumar, Satish; Thompson, Carl V.; Bakir, Muhannad S.; Kummel, Andrew C.
err分享
err收藏
Oxygen Vacancy Energetics and Kinetics at Hf0.5Zr0.5O2-WO3 Interfaces: Impact on Ferroelectric Behavior and Device FunctionalityHf0.5Zr0.5O2-WO3界面上的氧空位能量和动力学: 对铁电行为和器件功能的影响
errACS APPLIED ELECTRONIC MATERIALS
IF4.7
err2026-01-01
err0
PREAI
errNoor, Manifa; Kim, Jongchan; Bergschneider, Matthew; Kummel, Andrew C.; Cho, Kyeongjae
err分享
err收藏
High speed, high thermal-conductivity of aluminum nitride deposited by DC reactive sputtering at low temperature in the transition regime
errCeramics International
IF5.6
err2025-12-16
err0
PREAI
errSeongUk Yun; Dohyun Go; Mingeun Choi; Ramteja Kondakindi; Ping-Che Lee; Prabhakar R. Bandaru; Satish Kumar; Andrew C. Kummel
err分享
err收藏
High-speed AlN film deposition via low-pressure bipolar High power impulsed magnetron sputter for enhanced thermal conductivity低气压双极高压脉冲磁控溅射制备高速AlN薄膜以提高热导率
errTHIN SOLID FILMS
IF2
err2025-11-01
err0
PREAI
errLee, Ping-Che; Choi, Mingeun; Mora, Diego Contreras; Wang, Kesong; Yun, Seonguk; Go, Dohyun; Dutta, Jit; Pal, Dipayan; Kumar, Satish; Kummel, Andrew C.
err分享
err收藏
Liposomal Oncolytic Adenovirus Enables Efficient CAR-Independent Transduction of Tumors and Enhances NK Cell-Mediated Abscopal Responses脂质体溶瘤腺病毒能够实现高效的CAR非依赖性肿瘤转导，并增强NK细胞介导的远隔效应。
errACS Applied Materials and Interfaces
IF8.2
err2025-11-01
err0
PREAI
errDong, Tao; Shah, Jaimin R.; Phung, Abraham T.; Blair, Sarah L.; Trogler, William C.; Kummel, Andrew C.; Hayashi, Tomoko
err分享
err收藏
Spatio-chemical characterization and elimination of localized growth aberrations on monolayer MoS2 for enhanced performance top gated FETs with scaled ALD oxides单层MoS2的空化-化学表征与局部生长异常消除，以提升采用缩放ALD氧化物的顶部栅极FET的性能
errApplied Surface Science
IF6.9
err2025-10-18
err0
errOAAI
errShreyam Natani; Padraic O’Reilly; Sung Park; Ming-Yang Li; Matthias Passlack; Iuliana Radu; Andrew C. Kummel; Prabhakar Bandaru
err分享
err收藏
Effect of Defects on Formation of Inversion Domain Boundaries in AlScN and Their Structural/Electronic Properties Improvement缺陷对AlScN中反相畴界形成的影响及其结构/电子性能的改善
errJ. Mater. Chem. C
IF0
err2025-10-16
err0
PREAI
errTaesoon Hwang; Andrew C Kummel; Kyeongjae Cho
err分享
err收藏
Atomic Layer Deposition of TiOx/Al2O3 Nanofilms on Aluminum Screens for Enhanced Corrosion Resistance in Electrolyzers在铝筛网上进行TiOx/Al2O3纳米薄膜的原子层沉积以增强电解槽的耐腐蚀性
errACS Applied Nano Materials
IF5.5
err2025-08-05
err0
PREAI
errKesong Wang; Adam Paxson; Thomas Valdez; Ahmet Gün Erlat; Ping-Che Lee; Andrew C. Kummel; Prabhakar R. Bandaru
err分享
err收藏
Liposomal oncolytic adenovirus as a neoadjuvant therapy for triple-negative breast cancer脂质体溶瘤腺病毒作为三阴性乳腺癌的新辅助疗法
errSCIENTIFIC REPORTS
IF3.9
err2025-05-14
err0
errOAAI
errShah, Jaimin R.; Dong, Tao; Phung, Abraham T.; Khan, Sohini; Aisagbonhi, Omonigho; Blair, Sarah L.; Bouvet, Michael; Trogler, William C.; Kummel, Andrew C.
err分享
err收藏
Improved corrosion resistance and electrical characteristics of titanium, with atomic layer deposited (ALD) TiOx coating
errAPPLIED SURFACE SCIENCE
IF6.9
err2025-05-01
err0
errOAAI
errWang, Kesong; Paxson, Adam; Valdez, Thomas I.; Erlat, Ahmet G.; Lee, Ping-Che; Yun, Seonguk; Kummel, Andrew C.; Bandaru, Prabhakar R.
err分享
err收藏
Vapor-Deposited MOF for Low-k Dielectric Seamless High-Aspect-Ratio Interconnect Gap Fill气相沉积MOF用于低介电常数介质的无缝高纵横比互连间隙填充
errACS APPLIED MATERIALS & INTERFACES
IF8.2
err2025-02-24
err0
PREAI
errPal, D; Yang, N; Simka, H; Dutta, J; Wang, KS; Mu, J; Lee, PC; Wang, XY; Winter, CH; Kummel, AC
err分享
err收藏
Control polarity of gallium nitride on Si (111) using atomic layer annealing and thermal atomic layer deposition
errAPPLIED SURFACE SCIENCE
IF6.9
err2024-12-01
err0
PREAI
errYun, Seonguk; Lee, Ping-Che; Spiegelman, Jeffrey; Kummel, Andrew C.
err分享
err收藏
Nearly Barrierless Polarization Switching Mechanisms in ZrO2 Having Perpendicular In-Plane Domain Walls
errACS APPLIED MATERIALS & INTERFACES
IF8.2
err2024-10-30
err0
PREAI
errNoor, Manifa; Bergschneider, Matthew; Kim, Jongchan; Afroze, Nashrah; Khan, Asif Islam; Chang, Sou-Chi; Avci, Uygar E.; Kummel, Andrew C.; Cho, Kyeongjae
err分享
err收藏
Thermal Transport at the AlN-SiC Interface and Grain Boundary of AlN
errACS APPLIED MATERIALS & INTERFACES
IF8.2
err2024-09-17
err0
PREAI
errHwang, Taesoon; Lee, Ping-Che; Kummel, Andrew C.; Cho, Kyeongjae
err分享
err收藏

研究方向

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合作学者
合作期刊
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